Journal Paper:
[1] Yuan-Ming Chang, Shih-Hsien Yang, Che-Yi Lin, Chang-Hung Chen, Chen-Hsin Lien, Wen-Bin Jian, Keiji Ueno, Yuen-Wuu Suen, Kazuhito Tsukagoshi, and Yen-Fu Lin, “Reversible and Precisely Controllable p/n-Type Doping of MoTe2 Transistors through Electrothermal Doping”, Adv. Mater., 30, 1706995 March (2018)
[2] Wei-Ting Hsu, Li-Syuan Lu, Po-Hsun Wu, Ming-Hao Lee, Peng-Jen Chen, Pei-Ying Wu, Yi-Chia Chou, Horng-Tay Jeng, Lain-Jong Li , Ming-Wen Chu & Wen-Hao Chang, “Negative circular polarization emissions from WSe2/MoSe2 commensurate heterobilayers”, Nature Communications, 9:1356 Apr. (2018)
[3] Chao-Cheng Kaun, Yu-Chang Chen*, “Thermoelectric Charge and Spin Current Generation in Magnetic Single-Molecule Junctions: First-Principles Calculations”, J. Phys. Chem. C 122, 12185-12192 May (2018).
[4] T. N. Tran, T. N. Lam, C. Y. Yang, W. C. Lin, P. W. Chen, and Y. C. Tseng*, “Superparamagnetic ground state of CoFeB/MgO magnetic tunnel junction with dual-barrier”, Applied Surface Science 457, 529 (2018).
[5] Ya-Sheng Tang, Hsiu-Chi Chen, Yi-Tung Kho, Yu-Sheng Hsieh, Yao-Jen Chang, and Kuan-Neng Chen*, “Investigation and Optimization of Ultrathin Buffer Layers Used in Cu/Sn Eutectic Bonding”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 8(7), 1225 (2018).
[6] Chia-Hsun Wu, Ping-Cheng Han, Shih-Chien Liu, Ting-En Hsieh, Franky Juanda Lumbantoruan, Yu-Hsuan Ho, Jian-You Chen, Kun-Sheng Yang, Huan-Chung Wang , Yen-Ku Lin, Po-Chun Chang , Quang Ho Luc, Yueh-Chin Lin, and Edward Yi Chang*, ”High-Performance Normally-OFF GaN MIS-HEMTs Using Hybrid Ferroelectric Charge Trap Gate Stack (FEG-HEMT) for Power Device Applications”, IEEE Electron Device Letters, 39, 991 (2018).
[7] Chih-Han Tseng, K. N. Tu, Chih Chen*, “Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding” Scientific Reports 8:10671 (2018).
[8] Chia-Hsun Wu, Ping-Cheng Han, Quang Ho Luc, Ching-Yi Hsu, Ting-En Hsieh, Huan-Chung Wang, Yen-Ku Lin, Po-Chun Chang, Yueh-Chin Lin, Edward Yi Chang*, ” Normally-OFF GaN MIS-HEMT With F− Doped Gate Insulator Using Standard Ion Implantation” Journal of the electron devices society, 6, 893(2018).
[9] Ting‐Kai Huang, Jui‐Yuan Chen, Yi‐Hsin Ting, and Wen-Wei Wu* “Ni/NiO/HfO2 Core/Multishell Nanowire ReRAM Devices with Excellent Resistive Switching Properties,’’ Adv. Electronic Mater., 1800256, (2018).
[10] Yen-Ku Lin, Johan Bergsten, Hector Leong, Anna Malmros, Jr-Tai Chen, Ding-Yuan Chen, Olof Kordina, Herbert Zirath, Edward Yi Chang and Niklas Rorsman,” A versatile low-resistance ohmic contact process with ohmic recess and low temperature annealing for GaN HEMTs”, Semicond. Sci. Technol. 33, 095019 (2018).
[11] W.-X. You and P. Su, “Intrinsic Difference between 2D Negative-Capacitance FETs with Semiconductor-on-Insulator and Double-Gate Structures”, IEEE Transactions on Electron Devices, 65, 4196 (2018).
[12] Chen, Bo-Yuan; Chen, Kun-Ming*; Chiu, Chia-Sung; Huang, Guo-Wei; Chen, Hsiu-Chih; Chen, Chun-Chi; Hsueh, Fu-Kuo; Chang, Edward Yi, “Analog and RF Characteristics of Power FinFET Transistors With Different Drain-Extension Designs”, IEEE Transactions on Electron Devices, 65, 4225 (2018).
[13] Liang, Jaw-Yeu; Chou, Yu-Jun; Yin, Chiao-Wen; Lin, Wen-Chin; Lin, Hong-Ji; Chen, Po-Wen, Tseng, Yuan-Chieh, “Realization of an H2/CO dual-gas sensor using CoPd magnetic structures”, Applied Physics Letters, 113,182401-1 (2018).
[14] Juang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chen, Chao-Chang A.; Hsu, Po-Ning; Chen, Chih; Tu, K. N.,”Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient”, Scientific Reports, 8,13910-1(2018).
[15] Chu, Yi-Cheng; Chen, Chih,”Anisotropic grain growth to eliminate bonding interfaces in direct copper-to-copper joints using < 111> -oriented nanotwinned copper films”, Thin Solid Films, 667, 55 (2018).
[16] Van-Qui Le, Thi-Hien Do, José Ramón Durán Retamal, Pao-Wen Shao, Yu-Hong Lai, Wen-Wei Wu, Jr-Hau He, Yu-Lun Chueh and Ying-Hao Chu,”Van der Waals Heteroepitaxial AZO/NiO/AZO/Muscovite (ANA/muscovite) Transparent Flexible Memristor”, Nano Energy, Available online 23 October 2018. Impact Factor: 13.12
[17] Juang, Jing-Ye; Lu, Chia-Ling ; Li, Yu-Jin; Tu, K. N.; Chen, Chih,”Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu”, Materials, 11, 2368-1(2018).
[18] Wu, John A.; Huang, Chih-Yang; Wu Wen-Wei; Chen, Chih,” Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding”, Materials, 11, 2287-1(2018).
[19] Chang, Chia-Fu; Chen, Jui-Yuan; Huang, Guan-Min; Lin, Ting-Yi; Tai, Kuo-Lun; Huang, Chih-Yang; Yeh, Ping-Hung; Wu, Wen-Wei,” Revealing Conducting Filament Evolution in Low Power and High Reliability Fe3O4/Ta2O5 Bilayer RRAM”, Nano Energy, 53, 871(2018)
[20] Ho, Jo-Hsuan; Ting, Yi-Hsin; Chen, Jui-Yuan; Huang, Chun-Wei; Tsai, Tsung-Chun; Lin, Ting-Yi; Huang, Chih-Yang; Wu, Wen-Wei, ”Observing Solid-State Formation of Oriented Porous Functional Oxide Nanowire Heterostructures by in Situ TEM”, Nano Letter, 18, 6064 (2018).
[21]Lin, Ting Yi; Chen, Yong-Long; Chang, Chia-Fu; Huang, Guan-Min; Huang, Chun-Wei; Hsieh, Cheng-Yu ; Lo, Yu-Chieh; Lu, Kuo Chang; Wu, Wen-Wei; Chen, Lih-Juann, “In situ Investigation of Defect-free Copper Nanowire Growth”, Nano Letter, 18,778 (2018).
[22] Tai, Kuo‐Lun; Huang, Guan‐Min; Huang, Chun‐Wei; Tsai, Tsung‐Chun Lee, Shih‐Kuang; Lin, Ting‐Yi; Lo, Yu-Chieh; Wu, Wen-Wei, “Observing the Phase Transformation of CVD‐grown MoS2 via Atomic Resolution TEM”, Chemical Communications 54, 9941 (2018).
[23] Chen, Jui-Yuan; Huang, Chun-Wei; Wu, Wen-Wei, “Solid-State Diffusional Behaviors of Functional Metal Oxides at Atomic Scale”, Small 14, 1702877-1(2018).
[24] Ting, Yi-Hsin; Chen, Jui-Yuan; Huang, Chun-Wei; Huang, Ting-Kai; Hsieh, Cheng-Yu; Wu, Wen-Wei, “Observation of Resistive Switching Behavior in Crossbar Core-shell Ni/NiO Nanowires Memristor”, Small 14, 1703153-1(2018).
[25] Bin Ou Yang, Bailey C. Hsu and Yu-Chang Chen, “Quantum Noise of Current in a1,4-Benzenedithiol Single-Molecule Junction: First-Principle Calculations”, J. Phys.Chem. C. 122, 19266 (2018).
International Conference
[1] Kuan-Neng Chen, “Research Achievements of Key Technologies in 3D Integration and Heterogeneous Integration,” China Semiconductor Technology International Conference, Shanghai, China, Mar. 11-12, 2018.
[2] Yueh-Chin Lin, Jing-Neng Yao, Hisang-Hua Hsu, Ying-Chieh Wong, Chi-Yi Huang, Heng Tung Hsu, Hiroshi Iwai, Edward Yi Chang, “Study of the mesa etched tri-gate InAs HEMTs with extremely low SS for low-power logic applications”, 2018 China Semiconductor Technology International Conference (CSTIC), Shanghai, China, Mar. 11-12, 2018.
[3] Yu-Chang Chen, “Shot Noise in Benzenedithiol Single-molecule Junctions from the Perspective of Coherent Wave Function”, American Physical Society March Meeting, Los Angeles, California, March, 2018
[4] Chih-Yi Yang, Tian-Li Wu, Tin-En Hsieh, Edward Yi Chang, “Investigation of degradation phenomena in GaN-on-Si power MIS-HEMTs under source current and drain bias stresses”, 2018 IEEE International Reliability Physics Symposium (IRPS), Burlingame, CA, USA, Mar. 11-15, 2018.
[5] Wu, Y.-C.; Huang, P.-T.; Wu, S.-L.; Lung, S.-C.; Wang, W.-C.; Hwang, W.; Chuang, C.-T, “28nm Near/Sub-Threshold Dual-Port FIFO Memory for Shared Queues in Multi-Sensor Applications”, IEEE VLSI-DAT, Hsinchu, Taiwan, April 16-19, 2018.
[6] Kuan-Neng Chen, “Low Temperature Bonding Technology for 3D Integration and Advanced Packaging,” 2018 International Conference on Electronics Packaging (ICEP) Conference, Kuwana, Mie, Japan, Apr. 17-21, 2018.
[7] J. Y. Liang, K. M. Chen, K. W. Chang and Y. C. Tseng, “Co/Pd Multilayer Structure for Hydrogen Sensing”, IEEE InterMag, Singapore, April 23-27, 2018.
[8] Yi-Hsin Ting, Jui-Yuan Chen, Chun-Wei Huang, Ting-Kai Huang, Cheng-Yu Hsieh, and, Wen-Wei Wu, “Observing Electrochemical Switching Behaviors in Crossbar Core-Shell Ni/NiO Nanowires Memristor,” 233st ECS, Electrochem. Soc. Meeting, Seattle, WA, USA. May 13-17, 2018
[9] Chen, Fu-Chun; Lin, Ya Hsuan; Chen, Jui- Yuan; Wu, Wen-Wei, “In-Situ TEM Observation of Au-Cu2O Core-Shell Growth in Liquid”, 233st ECS, Electrochem. Soc. Meeting, Seattle, WA, USA. May 13-17, 2018
[10] Wu, Min-Ci; Chen, Jui-Yuan; Wu, Wen-Wei, “In Situ TEM Observation of Dynamic Switching Behaviors in VRRAM”, 233st ECS, Electrochem. Soc. Meeting, Seattle, WA, USA. May 13-17, 2018
[11] Chen, Jui- Yuan Huang, Chun-Wei, Wu, Wen-Wei, “Solid-State Diffusional Behaviors of Functional Metal Oxides at Atomic Scale”, 233st ECS, Electrochem. Soc. Meeting, Seattle, WA, USA. May 13-17, 2018
[12] Huang, Chih-Yang; Tao, Kuo-Lun; Lu, Ming-Yan; Wu, Wen-Wei, “Atomic Observation of Solid State Reaction in Fe/ZnO Bilayer”, 233st ECS, Electrochem. Soc. Meeting, Seattle, WA, USA. May 13-17, 2018
[13] Lin, Ya-Hsuan; Chen, Fu-Chun; Chen, Jui-Yuan; Wu, Wen-Wei, “Observing Growth and Dissolution of Cuprous by liquid cell TEM”, 233st ECS, Electrochem. Soc. Meeting, Seattle, WA, USA. May 13-17, 2018
[14] Yen-Teng Ho*, Tien-Tung Luong, Hung-Ru Hsu, Chao An Jong, Yung-Yi Tu and Edward Yi Chang “The Synthesis of Wafer Size MoS2 with Few Monolayers Using MoO3 and H2S”, IEEE SILICON NANOELECTRONICS WORKSHOP Honolulu, HI, USA, June 1 2018
[15] Tang, Y-T.; Su, C-J.; Wang, Y-S.; Kao, K-H.; Wu, T-L.; Sung, P-J.; Hou, F-J.; Wang, C-J.; Yeh, M-S.; Lee, Y-J.; Wu, W-F.; Huang, G-W.; Shieh, J-M.; Yeh, W-K.; Wang, Y-H., “A Comprehensive Study of Polymorphic Phase Distribution of Ferroelectric-Dielectrics and Interfacial Layer Effects on Negative Capacitance FETs for Sub-5 nm Node”, 2018 Symposia on VLSI Technology and Circuits, Honolulu, HI, June. 18-22, 2018.
[16] Q. H. Luc, C. C. Fan-Chiang, S. H. Huynh, P. Huang, H. B. Do, M. T. H. Ha, Y. D. Jin, T. A. Nguyen, K. Y. Zhang, H. C. Wang, Y. K. Lin, Y. C. Lin, C. Hu, H. Iwai, and E. Y. Chang, “First Experimental Demonstration of Negative Capacitance InGaAs MOSFETs With Hf0.5Zr0.5O2 Ferroelectric Gate Stack”, 2018 Symposia on VLSI Technology and Circuits, Honolulu, HI, June. 18-22, 2018.
[17] Useinov, Artur, “Quantized spin transfer torque in magnetic tunnel junctions with embedded nanoparticles”, XXIII International conference on Novels in Magnetism and Magnetic Materials, MIREA, Moscow, Russia, June 30-July 5, 2018
[18] Chan, Y.-S.; Huang, P.-T.; Wu, S.-L.; Lung, S.-C.; Wang, W.-C.; Hwang, W.; Chuang, Ch.-T., “0.4V Reconfigurable Near-Threshold TCAM in 28nm High-k Metal-Gate CMOS Process”, IEEE SOCC, Washington DC, USA, Sept.4-7, 2018
[19] Bo-Yuan Chen, Kun-Ming Chen, Yu-Shao Jerry Shiao, Guo-Wei Huang, Hsiu-Chih Chen, Fu-Kuo Hsueh, Jia-Min Shieh, and Edward-Yi Chang, “RF characteristics of trigate poly-Si thin-film transistors with different layout geometries”,
International Conference on Solid State Devices and Materials
(SSDM), Tokyo, Japan. Sept. 2018.
[20] Huang, Guan-Min; Tsai, Tsung-Chun; Huang, Chun-Wei; Wu, Wen-Wei, “Dynamic Observation of Reversible Lithium Storage Mechanism in Hybrid Supercapacitor Devices”, EMRS Fall Meeting, Warsaw, Poland, Sept.17-19, 2018.
[21] Tai, Kuo-Lun; Huang, Chun Wei; Huang, Guan Min; Wu, Wen-Wei, “Nanosculpting of atomic-layers MoS2”, EMRS Fall Meeting, Warsaw, Poland, Sept.17-19, 2018.
[22] Chen, Kuan-Neng, “From Cu-Based Direct Bonding to Hybrid Bonding: An Evolution of Low Temperature Bonding Technology”, SEMICON Taiwan, Taipei, Taiwan. Sept.18-20, 2018
[23] Chen, Kuan-Neng, “3D Integration and Advanced Packaging”, ADMETA 2018, Beijing, China, Oct.11-12, 2018.
[24] Chen, Kuan-Neng, “Low Temperature Bonding Technology for Advanced Packaging and 3D Integration”, ADMETA 2018, Beijing, China, Oct.11-12, 2018.
[25] Su, Pin.; You, W. X., “Device Structural Effects on Negative-Capacitance FETs”, 2018 IEEE SOI-3D-Subthreshold Microelectronics Unified Conference, San Francisco, USA. Oct.15-18, 2018
[26] You, W.-X.; Su, Pin. Hu, C., “Evaluation of NC-FinFET Based Subsystem-Level Logic Circuits Using SPICE Simulation”, 2018 IEEE SOI-3D-Subthreshold Microelectronics Unified Conference, San Francisco, USA. Oct.15-18, 2018
[27] Tseng, I-Hsin; Chen, Chih, “High Electromigration lifetimes of Nanotwinned Cu Redistribution Lines”, International Microsystems, Packaging, Assembly and Circuits Technology conference, Taipei, Taiwan. Oct.24-26, 2018
[28] Shie, Kai-Cheng; Juang, Jing-Ye; Chen, Chih, “Low Resistance Cu-to-Cu joints using highly (111)-oriented nanotwinned copper microbumps of 30 μm in diameter”, International Microsystems, Packaging, Assembly and Circuits Technology conference, Taipei, Taiwan. Oct.24-26, 2018
[29] Juang, Jing-Ye; Lu, Chia-Ling ; Chen, Kuan-Ju Chen, Chao-Chang A.; Hsu, Po-Ning; Chen, Chih; Tu, K. N., “Chip-to-Chip copper direct bonding in no-vacuum ambient with (111) oriented nanotwinned copper”, International Microsystems, Packaging, Assembly and Circuits Technology conference, Taipei, Taiwan. Oct.24-26, 2018
[30] Yi-Tang Chen, Chia-Sung Chiu, Chia-Wei Chuang, Kun-Ming Chen, Guo-Wei Huang, Sheng-Kai Peng, Yu-Ting Ke, and Lin-Kun Wu, “A miniature 92-95 GHz on-chip slow-wave branch-line coupler”, 2018 Asia Pacific Microwave Conference(APMC 2018), Kyoto Japan, Nov. 6-9, 2018
[31] Chen, Kuan-Neng, “Low Temperature Bonding Technology Development for 3D and Heterogeneous Integration”, ICSICT, Qingdao China, Oct.31-Nov.3, 2018
[32] Tung, Luong Tien; Ho, Yen-Teng; Chang, Edward Yi., “Reduction of temperature-dependent RF losses for GaN-HEMTs on Silicon substrate”, International Workshop on Nitride Semiconductors, KANAZAWA, Japan, Nov.13-16, 2018.
[33] Ku, Shu-Yun; Tsai, Yi-Chieh; Chen, Kuan-Neng,” Investigation of Fine-pitch Chip-level Cu-Cu Bonding Under Low Temperature”, IEDMS, Keelung, Taiwan. Nov.14-16, 2018
[34] Tseng, Chih-Han; Tu, K. N.; Chen, Chih, “Kinetic Study of Abnormal Grain Growth in Nanotwinned Copper Thin Films”, MRS-T, Taichung, Taiwan, Nov.16-17, 2018
[35] Li, Yu-Jin; Chen, Chih, “High Fatigue Resistance Nanotwinned Copper for Integrated Fan-Out Wafer Level Packaging”, MRS-T, Taichung, Taiwan, Nov.16-17, 2018
[36] Shie, Kai-Cheng; Juang, Jing-Ye; Chen, Chih, “Low Resistance Cu-to-Cu joints using highly (111)-oriented nanotwinned copper microbumps of 30 μm in diameter”, MRS-T, Taichung, Taiwan, Nov.16-17, 2018
[37] Tseng, I-Hsin; Chen, Chih, “High Electromigration lifetimes of Nanotwinned Cu Redistribution Lines”, MRS-T, Taichung, Taiwan, Nov.16-17, 2018
[38] Ting, Yi-Hsin; Huang, Chun-Wei; Chen, Jui- Yuan; Wu, Min-Ci; Wu, Wen-Wei, “Atomic Imaging of Molybdenum Oxide Nanowires with Unique and Complex Periodicity Through Advanced Electron Microscope Technology”, MRS Fall Meeting, Boston, MA, USA. Nov.25-30, 2018.
[39] Wu, Min-Ci; Ting, Yi-Hsin; Chen, Jui- Yuan; Hsieh, Tsung-Eong; Wu, Wen-Wei, ”In-Situ TEM Investigation of 3D Vertical RRAM Array”, MRS Fall Meeting, Boston, MA, USA. Nov.25-30, 2018.
[40] Chun-Liang Lin, “Spectroscopic Appearance of Topological Nature in Two Weyl Semimetals”, MRS Fall Meeting, Boston, MA, USA. Nov.25-30, 2018.
[41] Wu, Chia-Hsing Ho, Yen-Teng; Yang, C.S, “Epitaxial growth of 2D layered InSe by using molecular beam epitaxy”,
Annual Conference on Nanoscience, Nanotechnology and Advanced materials, Bali, Indonesia. Nov.26-28, 2018
[42] Yang, Chih-Chao; Hsieh, Tung-Ying; Huang, Po-Tsang; Chen, Kuan-Neng; Wu, Wan-Chi; Chen, Shih-Wei; Chang, Chia-He, Shen, Chang-Hong; Shieh, Jia-Min; Hu, Chenming; Wu, Meng-Chyi; and Yeh, Wen-Kuan, “Location-controlled-grain Technique for Monolithic 3D BEOL FinFET Circuits”, International Electron Devices Meeting (IEDM), San Francisco, USA. Dec.1-4, 2018
[43] Kai-Shin Li, Yun-Jie Wei, Yi-Ju Chen, Wen-Cheng Chiu, Hsiu-Chih Chen, in-Hung Lee, Yu-Fan Chiu, Fu-Kuo
Hsueh, Bo-Wei Wu, Pin-Guang Chen, Tung-Yan Lai, hun-Chi Chen, Jia-Min Shieh, Wen-Kuan Yeh, Sayeef Salahuddin, Chenming Hu, “Negative-Capacitance FinFET Inverter, Ring Oscillator, SRAM Cell, and Ft”, International Electron Devices Meeting (IEDM), San Francisco, USA. Dec.1-4, 2018
[44] Chung, Ming-Han; Liu, Yen-Ting; Lee, Hsin-Yi; Tseng, Yuan-Chieh, “Epitaxial GdFe0.8Ni0.2O3 Multiferroic Thin Films Grown Device Using Operando X-ray Technique”, 2018 Pacific Symposium on Surface, Coating & Interfaces Conference, Hawaii, USA. Dec.2-6, 2018
[45] Chen, Kai-Wen; Chen, Syuan-Ye; Tseng, Yuan-Chieh; Chang, Shu-Jui, “Non-volatile Memory Based on Negative Capacitance and Photovoltaic Effect”, 2018 Pacific Symposium on Surface, Coating & Interfaces Conference, Hawaii, USA. Dec.2-6, 2018
[46] Li, Kuan-Sheng; Yang, Chueh-Cheng; Wang, Chia-Hsin; Tseng, Yuan-Chieh; Chang, Shu-Jui, “Investigation of CO2 Sensing Efficiency and Mechanism Based on P-type MoS2”, 2018 Pacific Symposium on Surface, Coating & Interfaces Conference, Hawaii, USA. Dec.2-6, 2018
[47] Chen, Yi-Hsuan; Su, Chun-Jung; Hu, Chenming; Wu, Tian-Li, “Impact of the Annealing Temperature on C-V Characteristics of Ferroelectric HfZrOx on a p-type Si Substrate”, 49th IEEE Semiconductor Interface Specialists Conference (SISC), San Diego, USA. Dec.5-8, 2018.
