2019期刊論文發表 54篇如下:
- Ramesh Kumar Kakkerla, Deepak Anandan, Sankalp Kumar Singh, Hung Wei Yu, Ching-Ting Lee, Chang-Fu Dee, Burhanuddin Yeop Majlis, Edward Yi Chang, “Crystal structure control of Au-free InAs and InAs/GaSb heterostucture nanowires grown on Si (111) by metal-organic chemical vapor deposition,” Appl. Phys. Express 12, 015502 (2019). (Impact Factor: 2.77) Q1(國際合作)
- Chih-Han Tseng and Chih Chen*, “Growth of Highly (111)-Oriented Nanotwinned Cu with the Addition of Sulfuric Acid in CuSO4 Based Electrolyte” Crystal Growth and Design, 19, 81−89 (2019). (Impact Factor:4.15) Q1
- T. Wu, and C. Chen, “Low Temperature Cu-to-Cu Bonding in Non-vacuum Atmosphere with Thin Gold Capping on Highly (111) Oriented Nanotwinned Copper.” Journal of Electronic Materials, 49, 13 (2020) (Impact Factor:1.66) Q2
- J. Wang, C. S. Ku, T. N. Lam, E. W Huang, K. N. Tu, and C. Chen, “Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure.” Journal of Electronic Materials, 49, 13. (2020) (Impact Factor:1.66) Q2(國際合作)
- Chang-Hsun Huang, Anahita Pakzad, Wei-I Lee, and Yi-Chia Chou*, “Structure and Strain Relaxation of GaN Nanorods Grown on Homoepitaxial Surface via Controlling Irregular Mask” Phys. Chem. C 123, 3172 (2019). (Impact Factor:4.31) Q1(國際合作)
- Yi-Ting Chiang, Yi Chou, Chang-Hsun Huang, Wei-Ting Lin, Yi-Chia Chou*, “Dependence of Structure and Orientation of VSS grown Si nanowires on Epitaxy Process” CrystEngComm, 21, 4298-4304 (2019). (Impact Factor:3.38) Q1
- E-Wen Huang*, Soo Yeol Lee, Jayant Jain, Yang Tong, Ke An, Nien-Ti Tsou, Tu-Ngoc Lam, Dunji Yu, Hobyung Chae, Shi-Wei Chen, Shih-Min Chen, and Hung-Sheng Chou, “Hardening steels by the generation of transient phase using additive manufacturing” Intermetallics 109, 60-67 (2019). (Impact Factor:3.35) Q1(國際合作)
- E-Wen Huang*, Chih-Ming Lin, Jenh-Yih Juang, Yao-Jen Chang, Yuan-Wei Chang, Chan-Sheng Wu, Che-Wei Tsai, An-Chou Yeh, Sean R. Shieh, Ching-Pao Wang, Yu-Chun Chuang, Yen-Fa Liao, Dongzhou Zhang, Tony Huang, Tu-Ngoc Lam, Yi-Hung Chen, “Deviatoric deformation kinetics in high entropy alloy under hydrostatic compression”, Journal of Alloys and Compounds, 792, 116-121 (2019). (Impact Factor:3.78) Q1(國際合作)
- Pei-I. Tsai, Tu-Ngoc Lam, Meng-Huang Wu, Kuan-Ying Tseng, Yuan-Wei Chang, Jui-Sheng Sun, Yen-Yao Li, Ming-Hsueh Lee, San-Yuan Chen, Chung-Kai Chang, Chun-Jen Su, Chia-Hsien Lin, Ching-Yu Chiang, Ching-Shun Ku, Nien-Ti Tsou, Shao-Ju Shih, Chun-Chieh Wang, and E-Wen Huang*, “Multi-scale mapping for collagen-regulated mineralization in bone remodeling of additive manufacturing porous implants” Materials Chemistry and Physics, 230, 83-92 (2019). (Impact Factor:2.21) Q2
- Tu-Ngoc Lam, You-Shiun Chou, Yao-Jen Chang, Tsung-Ruei Sui, An-Chou Yeh, Stefanus Harjo, Soo Yeol Lee, Jayant Jain, Bo-Hong Lai, and E-Wen Huang*, “Comparing Cyclic Tension-Compression Effects on CoCrFeMnNi High-Entropy Alloy and Ni-Based Superalloy” Crystals, 9, 420-427 (2019) (Impact Factor:2.14) Q2(國際合作)
- Tu-Ngoc Lama, Chun-Chieh Wang*, Wen-Ching Ko, Jyh-Ming Wu, Sz-Nian Lai , Wei-Tsung Chuang, Chun-Jen Su, Chia-Yin Ma, Mao-Yuan Luo, Ying-Jhih Wang, and E-Wen Huang*, “Tuning mechanical properties of electrospun piezoelectric nanofibers by heat treatment” Materialia, 8, 100461(2019). (國際合作)
- E-Wen Huang*, Hung-Sheng Chou*, K. n. Tu, Wei-Song Hung, Tu-Ngoc Lam, Che-Wei Tsai, Ching-Yu Chiang, Bi-Hsuan Lin, An-Chou Yeh, Shan-Hsiu Chang, Yao-Jen Chang, Jun-Jie Yang, Xiao-Yun Li, Ching-Shun Ku, Ke An*, Yuan-Wei Chang, and Yu-Lun Jao, “Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium Heating” Scientific Reports, 9, 14788 (2019). (Impact Factor:4.12) Q1(國際合作)
- Tu-Ngoc Lam, Chen-Hsien Wu, Sheng-Hsiu Huang, Wen-Ching Ko, Yu-Lih Huang,Chia-Yin Ma, Chun-Chieh Wang* , and E-Wen Huang*, “Multi-Scale Microstructure Investigation for a PM2.5 Air-Filter Efficiency Study of Non-Woven Polypropylene” Quantum beam science, 3, 20(2019). (國際合作)
- -E. Huang, C.-L. Yu, and P. Su, “Investigation of Fin-Width Sensitivity of Threshold Voltage for InGaAs and Si Negative-Capacitance FinFETs Considering Quantum-Confinement Effect,” IEEE Transactions on Electron Devices, 66, 2538-2543, (2019). (Impact Factor:2.62) Q1
- -X. You, P. Suand C. Hu, “Evaluation of NC-FinFET Based Subsystem-Level Logic Circuits,” IEEE Transactions on Electron Devices, 66, 2004-2009 (2019). (Impact Factor:2.62) Q1
- -X. You and P. Su, “Depolarization Field in Ferroelectric Nonvolatile Memory Considering Minor Loop Operation,” IEEE Electron Device Letters, 40, 1415-1418 (2019).(Impact Factor: 3.75) Q1
- Fu-Chun Chen, Jui-Yuan Chen, Ya-Hsuan Lin, Ming-Yu Kuo, Yung-Jung Hsu, and Wen-Wei Wu*, “In Situ TEM Observation of Au-Cu2O Core-Shell Growth in Liquid,” Nanoscale, 11: 10486-10492 (2019). (Impact Factor:6.97) Q1
- Wan-Jhen Lin, Ting-Yi Lin, Chun-Wei Huang, Yi-Hsin Ting, Tsung-Chun Tsai, Chih-Yang Huang, Chih-Yang Huang, Shu-Meng Yang, Kuo Chang Lu, and Wen-Wei Wu* “Unique amorphization-mediated growth to form heterostructured silicide nanowires by solid-state reactions,’’ Materials & Design, 169, 107674 (2019). (Impact Factor:5.77) Q1
- Van-Qui Le, Thi-Hien Do, José Ramón Durán Retamal, Pao-Wen Shao, Yu-Hong Lai, Wen-Wei Wu, Jr-Hau He, Yu-Lun Chueh and Ying-Hao Chu “Van der Waals Heteroepitaxial AZO/NiO/AZO/Muscovite (ANA/muscovite) Transparent Flexible Memristor,’’ Nano Energy, 56, 322-329(2019). (Impact Factor:15.55) Q1 (國際合作)
- Che‐Yi Lin, Chao‐Fu Chen, Yuan‐Ming Chang, Shih‐Hsien Yang, Ko‐Chun Lee, Wen-Wei Wu*, Wen‐Bin Jian and Yen‐Fu Lin* “A Triode Device with a Gate Controllable Schottky Barrier: Germanium Nanowire Transistors and Their Applications,’’ Small, 1900865 (2019). (Impact Factor:10.86) Q1
- Ya-Hsuan Lin, Jui-Yuan Chen, Fu-Chun Chen, Ming-Yu Kuo, Yung-Jung Hsu, and Wen-Wei Wu* “In Situ Analysis of Growth Behaviors of Cu2O Nanocubes in Liquid Cell TEM,’’ Analytical Chemistry, 91, 9665-9672 (2019). (Impact Factor:6.35) Q1
- Ting-Yi Lin, Shih-Kuang Lee, Guan-Min Huang, Chun-Wei Huang, Kuo-Lun Tai, Chih-Yang Huang, Yu-Chieh Lo, and Wen-Wei Wu* “Electron Beam Irradiation-Induced Deoxidation and Atomic Flattening on Copper Surface,’’ ACS Appl. Mater. Interfaces, 11, 43, 40909-40915 (2019). (Impact Factor:8.45) Q1
- Min‐Ci Wu, Yi‐Hsin Ting, Jui‐Yuan Chen, and Wen-Wei Wu* “Low Power Consumption Nanofilamentary ECM and VCM Cells in a Single Sidewall of High‐Density VRRAM Arrays,’’ Adv. Sci. 6, 1902363 (2019). (Impact Factor:15.8) Q1
- Chih-Yang Huang, Kuo-Lun Tai, Chun-Wei Huang, Yi-Tang Tseng, Hung-Yang Lo,and Wen-Wei Wu* “Dynamic observation on the functional metal oxide conversion behaviors in Fe3O4/ZnO heterostructures,’’ Scr. Mater. 177, 192-197 (2019). (Impact Factor:4.74) Q1
- Yi-Hsin Ting, Chun-Wei Huang, Akira Yasuhara, Sheng-Yuan Chen, Jui-Yuan Chen, Li Chang, Kuo-Chang Lu*, and Wen-Wei Wu* “Atomic Imaging of Molybdenum Oxide Nanowires with Unique and Complex Periodicity by Advanced Electron Microscopy”, Nano Lett. (2019) DOI: 10.1021/acs.nanolett.9b03510. (Impact Factor:12.28) Q1(國際合作)
- Kuo-Lun Tai, Chun-Wei Huang, Ren-Fong Cai, Guan-Ming Huang, Ti-Tang Tseng, Jun Chen amd Wen-Wei Wu*, “Atomic-Scale Fabrication of In-Plane Heterojunctions of Few-Layer MoS2 via In Situ Scanning Transmission Electron Microscopy”, Small, 1905516 (2019). (Impact Factor:10.86) Q1(國際合作) “獲選為當期封面故事”
- Guan-Min Huang, Chun-Wei Huang, Nagesh Kumar, Chih-Yang Huang, Tseung-Yuen Tseng, and Wen-Wei Wu, “In situ TEM investigation of electron beam-induced ultrafast chemical lithiation for charging’’ J. Mater. Chem. A, 8, pp648-655 (2020). (Impact Factor:10.73) Q1 (國際合作)
- Chih-Yang Huang, Yi-Tang Tseng, Hung-Yang Lo, Jeng-Kuei Chang, and Wen-Wei Wu, “In situ atomic scale investigation of Li7La3Zr2O12-based Li+-conducting solid electrolyte during calcination growth’’ Nano Energy, 71, 104625, (2020). (Impact Factor:15.55) Q1
- Yi-Hsuan Chen, Chun-Jung Su, Chenming Hu, and Tian-Li Wu*, “Effects of Annealing on Ferroelectric Hafnium Zirconium Oxide-Based Transistor Technology,” IEEE Electron Device Letters, 40, 467-470 (2019). (Impact Factor: 3.75) Q1
- Bo-Yuan Chen, Kun-Ming Chen, Yu-Shao Jerry Shiao, Chuang-Ju Lin, Guo-Wei Huang, Hsiu-Chih Chen, Fu-Kuo Hsueh, Chang-Hong Shen, Jia-Min Shieh, Edward Yi Chang, “DC and high-frequency characteristics of trigate polycrystalline-silicon thin-film transistors with different layout geometries” Japanese Journal of Applied Physics 58, SBBJ05 (2019). (Impact Factor: 1.47) Q2
- Venkatesan Nagarajan, Kun-Ming Chen, Huan-Chung Wang, Sankalp Kumar Signh, Deepak Anandan, Yueh-Chin Lin, Edward Yi Chang, “A Simple Extraction Method for Parasitic Series Resistances in GaN HEMTs Considering Non-Quasi-Static Effects”, Microelectronics Journal, 87, 51-54. (2019) (Impact Factor: 1.28) Q2
- Jing Neng Yao, Yueh Chin Lin, Min Song Lin, Ting Jui Huang, Heng Tung Hsu, Simon M. Sze, Edward Y. Chang, “Evaluation of an InAs HEMT with source-connected field plate for highspeed and low-power logic applications”, Solid State Electronics 157, 55-60 (2019) (Impact Factor: 1.49) Q2
- Jing-Neng Yao, Yueh-Chin Lin, Ying-Chieh Wong, Ting-Jui Huang, Heng-Tung Hsu, Simon M. Sze, and Edward Yi Chang,” Communication—Potential of the π-Gate InAs HEMTs for High-Speed and Low-Power Logic Applications”, ECS Journal of Solid State Science and Technology, 8 (6), P319-321 (2019) (Impact Factor: 1.79) Q2
- Deepak Anandan, Venkatesan Nagarajan, Ramesh Kumar Kakkerla, Hung Wei Yu, Hua Lun Ko, Sankalp Kumar Singh, Ching Ting Lee, Edward Yi Chang, “Crystal Phase Control in Self-catalyzed InSb Nanowires Using Basic Growth Parameter V/III Ratio”, Journal of Crystal Growth, 522, 30-36 (2019) (Impact Factor: 1.57) Q2
- Deepak Anandan, Ramesh Kumar Kakkerla, Hung Wei Yu, Hua Lun Ko, Venkatesan Nagarajan, Sankalp Kumar Singh, Ching Ting Lee, Edward Yi Chang, “Growth of foreign-catalyst-free vertical InAs/InSb heterostructure nanowires on Si (1 1 1) substrate by MOCVD,” Journal of Crystal Growth, 506, 45-54 (2019). (Impact Factor: 1.57) Q2
- Chia-Hsun Wu, Jian-You Chen, Ping-Cheng Han, Ming-Wen Lee, Kun-Sheng Yang, Huan-Chung Wang, Po-Chun Chang, Quang Ho Luc, Yueh-Chin Lin, Chang-Fu Dee, Azrul Azlan Hamzah, Edward Yi Chang, “Normally-Off Tri-Gate GaN MIS-HEMTs with 0.76 mΩ·cm2 Specific On-Resistance for Power Device Applications”, IEEE Transactions on Electron Devices, 66, 3441 – 3446 (2019). (Impact Factor:2.62) Q1(國際合作)
- Sankalp Kumar Singh, Ramesh Kumar Kakkerla, H Bijo Joseph, Ankur Gupta, Deepak Anandan, Venkatesan Nagarajan, Hung Wei Yu, D John Thiruvadigal, Edward Yi Chang, “Optimization of InAs/GaSb core-shell nanowire structure for improved TFET performance” Materials Science in Semiconductor Processing, 101, 247-252 (2019). (Impact Factor:2.72) Q1(國際合作)
- Cheng-Hsien Lu, Shu-Yan Jhu, Chiao-Pei Chen, Bin-Ling Tsai, and Kuan-Neng Chen, “Asymmetric Wafer-level Polyimide and Cu/Sn Hybrid Bonding for 3D Heterogeneous Integration,” IEEE Transactions on Electron Devices, 66(7), 3073-3079 (2019). (Impact Factor:2.62) Q1
- Cheng-Hsien Lu, Yi-Tung Kho, Chiao-Pei Chen, Bin-Ling Tsai, and Kuan-Neng Chen, “Adhesion and Material Properties between Polyimide and Passivation Layers for Polymer/Metal Hybrid Bonding in 3D Integration”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 3(9), 412-418, (2019). (Impact Factor: 2.26) Q1
- J. Chang, M. H. Chung, M. Y. Kao, S. F. Lee, Y. H. Yu, C. C. Kaun, T. Nakamura, N. Sasabe, S. J. Chu and Y. C. Tseng*, “GdFe0.8Ni0.2O3: a multiferroic material for low-power spintronic devices with high storage capacity, ACS Applied Materials & Interfaces, 11, 31562 (2019). (Impact Factor:8.46) Q1(國際合作)
- J. Chang, S. Y. Chen, P. W. Chen, S. J. Huang, and Y. C. Tseng*, “Pulse-driven non-volatile perovskite memory with photovoltaic read-out characteristics”, ACS Applied Materials & Interfaces, 11, 33803-33810 (2019). (Impact Factor:8.46) Q1
- Y. Chung, C.F. Li, C.T. Lin, Y.T. Ho and C.H. Chien, “Experimentally Determining the Top and Edge Contact Resistivities of Two-step Sulfurization Nb-Doped MoS2 Films Using the Transmission Line Measurement,” IEEE Electron Device Lett., 40, 1662-1665 (2019) DOI: 10.1109/LED.2019.2935538 (Impact Factor: 3.75) Q1
- Y. Chung, K.C. Lu, C.C. Cheng, M.Y. Li, C.T. Lin, C.F. Li, J.H. Chen, T.Y. Lai, K.S. Li, J.M. Shieh, S.K. Su, H.L. Chiang, T.C. Chen, L.J. Li, H.-S. Philip Wong, Fellow, IEEE, W.B. Jian and C.H. Chien “Demonstration of 40-nm Channel Length Top-Gate p-MOSFET of WS2 Channel Directly Grown on SiOx/Si Substrates Using Area-Selective CVD Technology,” IEEE Transactions on Electron Devices, 66, 12, Dec. (2019) DOI: 10.1109/TED.2019.2946101(Impact Factor:2.62) Q1
- Iwan Susanto, Chi-Yu Tsai, Fachruddin, Tia Rahmiati, Yen-Ten Ho, Ping-Yu Tsai, Ing-SongYu, “The influence of 2D MoS2 layers on the growth of GaN films by plasmaassisted molecular beam epitaxy”, Applied Surface Science 496, 143616 (2019) (Impact Factor:5.15) Q1 (國際合作)
- Emmanuele Galluccio, Nikolay Petkov , Gioele Mirabelli , Jessica Doherty, Shih-Ya Lin, Fang-Liang Lu, W. Liu, Justin D. Holmes, “ Ray DuffyFormation and characterization of Ni, Pt, and Ti stanogermanide contacts on Ge0.92Sn0.08”, Thin Solid Films 690, 137568 (2019) (Impact Factor:1.88) Q2 (國際合作)
- Pin-Shiang Chen and W. Liu, “Theoretical Calculation of Ferroelectric Hf1-xZrxO2 by First-Principle Molecular Dynamic Simulation,” Mater. Res. Express6, 095045, (2019) (Impact Factor:1.45) Q2
- Tsutsui, Y.-C. Chen, “Heat dissipation in quasi-ballistic single-atom contacts at room temperature,” Scientific Report, 9, 18677 (2019). (Impact Factor:4.12) Q1
- Turenne and A. Useinov, “Direct Tunneling and related TMR anomalies in magnetic tunnel junctions with embedded nanoparticles” IEEE Trans. on Mag. 55, 1-4 (2019). (Impact Factor:1.65) Q2
- Ranjit A. Patil, Hao-Wei Tu, Ming-Hsing Jen, Jing-Jia Lin, Ching-Cherng Wu, Chun-Chuen Yang, Duy Van Pham, Chih-Hung Tsai, Chien-Chih Lai, Yung Liou, Wen-Bin Jian*, and Yuan-Ron Ma*, “Intriguing field-effect-transistor performance of two-dimensional layered and crystalline CrI3,” Materials Today Physics, published online, https://doi.org/10.1016/j.mtphys.2019.100174. (Impact Factor:24.372) Q1
- H. Yang, C. J. Su*, Y. S. Wang, K. H. Kao, Y. J. Lee, T. L. Wu*, “Impact of the Polarization on Time-Dependent Dielectric Breakdown in Ferroelectric Hf0.5Zr0.5O2 on Ge Substrates,” Jpn. J. Appl. Phys., 59, SGGB08 (2020) (Impact Factor: 1.47) Q2
- Chiung-Yuan Lin, Szu-Wen Yang, Keng-Liang Ou, and Barbara A. Jones, “Activated layered magnetism from bulk TiN”, Phys. Rev. Materials 3, 124412 (Impact Factor:2.96) Q1(國際合作)
- W-X. You, P. Su and C. Hu, “A New 8T Hybrid Nonvolatile SRAM with Ferroelectric FET,” IEEE Journal of the Electron Devices Society, vol. 8, pp. 171-175 (2020). (Impact Factor:2.0) Q1
- Y-S. Liu and P. Su, “Variability Analysis for Ferroelectric FET Nonvolatile Memories Considering Random Ferroelectric-Dielectric Phase Distribution,” IEEE Electron Device Letters, vol. 41, no. 3, pp. 369-372 (2020). (Impact Factor: 3.75) Q1
- S-E. Huang, S.-H. Lin, and P. Su, “Investigation of Inversion Charge Characteristics and Inversion Charge Loss for InGaAs Negative-Capacitance Double-Gate FinFETs Considering Quantum Capacitance,” IEEE Journal of the Electron Devices Society, vol. 8, pp. 105-109 (2020). (Impact Factor:2.0) Q1
International Conference 55篇,如下:
- Sankalp Kumar Singh, Ankur Gupta, Deepak Anandan, Ramesh Kumar Kakkerla, Venkatesan Nagarajan, Hung Wei Yu, A. Mohan Babu, N. Mohan Kumar, Edward Yi Chang, “Noise Analysis in InAs/GaSb Heterostructure Tunnel Field Effect Transistor”, 5th International Conference on Nanoscience and Nanotechnology (ICONN), Chennai, India, Jan. 28-30, 2019.
- Sankalp Kumar Singh, Ankur Gupta, Venkatesan Nagarajan, Deepak Anandan, Ramesh Kumar Kakkerla, Hung Wei Yu, Edward Yi Chang, “A novel p-channel GaSb based TFET with Pocket implant”, 5th International Conference on Nanoscience and Nanotechnology (ICONN), Tamil Nadu, India, Jan. 28-30, 2019.
- S-E. Huang, S.-H. Lin, and P. Su, “Analysis and Design of InGaAs Negative-Capacitance FinFETs considering Quantum Capacitance,” 3rd Electron Devices Technology and Manufacturing (EDTM) Conference 2019, Singapore, March 2019.
- Wen-Bin Jian, Pang-Chia Chang, Chun-Yang Ho, Zheng-Ji Ou, Ching-Hwa Ho, “Anisotropic electron transport behaviors in few-layer ReSe2”, Bulletin of the American Physical Society, March 5, 2019.
- Chanho Lee, Gian Song, Wei Chen, Michael Gao, Yi Chou, Yi-Chia Chou, Jamieson Brechtl, Hahn Choo, Peter Liaw “Lattice Distortion and Its Effect on Mechanical Behavior in Single-Phase Nb-Ta-Ti-V-Zr Refractory High-entropy Alloy Systems” TMS Annual Meeting, San Antonio, USA. Mar. 10-14, 2019.
- Yi-Chia Chou, Yi Chou, Chanho Lee, Peter Liaw, “Measurement of Lattice Distortion in High Entropy Alloys” TMS Annual Meeting, San Antonio, USA, March 10-14 (2019). (Invited paper)
- Chun-Liang Lin, “Topological Appearances between Two Type-II Weyl Semimetals” APS March Meeting, Boston”, USA Mar. 4-9, 2019.
- Chi-Feng Li, Yun-Yan Chung, Chao-Ting Lin, Yen-Teng Ho and Chao-Hsin Chien,“Comparison of Experimentally Extracted Top and Edge Contact Resistivity by TLM Structure with Two-step Sulfurization Nb-Doped MoS2”, 2019 Electron Devices Technology and Manufacturing Conference (EDTM), Singapore, 12-15 March 2019
- Su (Invited) and W.-X. You, “Device Structural Effects, SPICE Modeling and Circuit Evaluation for Negative-Capacitance FETs,” 2019 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, April 2019.
- Yi-Tang Tseng, Kuo-Lun Tai, Po-Wei. Wu, and Wen-Wei Wu* “Sub 10nm localized thinning of atomic layers WS2 through in-situ STEM/TEM”, Materials Research Society (MRS), Phoenix, Arizona, USA. Apr.22-26, 2019.
- Hsin-Mei Lu, Chih-Yang Huang and Wen-Wei Wu* “Dynamic Investigation of Titanium Disilicide Formation by In Situ TEM”, Materials Research Society (MRS), Phoenix, Arizona, USA. Apr.22-26, 2019.
- An-Yuan Hou, Chih-Yang Huang, and Wen-Wei Wu* “In-situ TEM investigation of low resistivity NiSi formation on Silicon layer”, Materials Research Society (MRS), Phoenix, Arizona, USA. Apr.22-26, 2019.
- Hung-Yang Lo, Guan-Min Huang and Wen-Wei Wu* “Direct observation of conducting channels in SrCoOx layer”, Materials Research Society (MRS), Phoenix, Arizona, USA. Apr.22-26, 2019.
- W. Huang, K.C. Shie, H.C. Liu, Y.J. Li, H.Y. Cheng, and C. Chen, “Copper-to-copper direct bonding using different (111) surface ratios of nanotwinned copper films”, 2019 International Conference on Electronics Packaging (ICEP), Niigata, Japan. April 17-20, 2019
- Yu-Jin Li, Wei-Yu Hsu, Benson Lin, ChiaCheng Chang, Chih Chen, “High-toughness (111) nano-twinned copper lines for fan-out wafer-level packaging”, 2019 International Conference on Electronics Packaging (ICEP), Niigata, Japan. April 17-20, 2019
- Emmanuele Galluccio, Gioele Mirabelli, Dan O’Connell, Jessica Anne Doherty, Nikolay Petkov, Justin D. Holmes, Shih-Ya Lin, Fang-Liang Lu, W. Liu, and Ray Duffy, “Ni, Pt, and Ti stanogermanide formation on Ge0.92Sn0.08”, 5th joint EUROSOI – ULIS 2019 Conference, Grenoble, France, April 1-3, 2019
- Chih Chen, Jing-Ye Juang, Shih Yang Chang, Kai Cheng Shie, Yu Jin Li, and K. N. Tu, “Low-temperature Cu-to-Cu direct bonding enabled by highly (111)-oriented and nanotwinned Cu”, 2019 International Conference on Electronics Packaging (ICEP), Niigata, Japan. April 17-20, 2019
- Yi-Lun Yang, Jia-Ling Liu, Guan Wei Chen, Shoichi Kodama, Kyosuke Kobinata, Kuan-Neng Chen, Hiroyuki Ito, Young Suk Kim, Takayuki Ohba, “Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation,” 2019 International Conference on Electronics Packaging (ICEP) Conference, Toki Messe, Niigata, Japan, Apr. 17-20, 2019.
- Jing Ye Juang, Kai Cheng Shie1, Po-Ning Hsu1, Yu Jin Li, K N Tu, and Chih Chen, “Low-resistance and high-strength copper direct bonding in no-vacuum ambient using highly (111)-oriented nano-twinned copper”, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, USA. May 28-31, 2019
- Edward Yi Chang, Ho Quang Luc, Chin Yueh Lin, “High-Performance In0. 53Ga0. 47 As FinFETs for logic and RF Applications”, 2019 Compound Semiconductor Week (CSW), Nara, Japan, May 19-23, 2019.
- Ping-Cheng Han, Chia-Hsun Wu, Yu-Hsuan Ho, Zong-Zheng Yan, Edward Yi Chang, “Recess-Free Normally-off GaN MIS-HEMT Fabricated on Ultra-Thin-Barrier AlGaN/GaN Heterostructure”, 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD), Shanghai, China, May 19-23, 2019.
- P-C. Han, C.-Y. Yang, M.-W. Lee, J.-S. Wu, C.-H. Wu and Edward Yi Chang, “High Performance Normally-Off AlGaN/GaN MIS-HEMT Using Charge Storage Technique”, 2019 Compound Semiconductor Week (CSW), Nara, Japan, May 19-23, 2019.
- Kai-Ming Yang, Tzu-Chieh Chou, Cheng-Ta Ko, Chen-Hao Lin, Yu-Hua Chen, Tzyy-Jang Tseng, Wen-Wei Wu, and Kuan-Neng Chen, “Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package,” 6th International Workshop on Low Temperature Bonding for 3D Integration, Kanazawa, Japan, May 21-25, 2019.
- Yu-Jin Li, Chih-Han Theng, I-Hsin Tseng, and Chih Chen, “Highly (111)-oriented Nanotwinned Cu for High Fatigue Resistance in fan-out wafer-level packaging”, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, USA. May 28-31, 2019
- I-Hsin Tseng,Yu-Jin Li, Benson Lin, Chia-Cheng Chang, and Chih Chen, “High Electromigration Lifetimes of Nanotwinned Cu Redistribution Lines”, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, USA. May 28-31, 2019
- Edward Yi Chang, Yen-Ku Lin, “Ohmic Contacts with low contact resistance for GaN HEMTs”, 2019 19th International Workshop on Junction Technology (IWJT), Kyoto, Japan, June 6-7, 2019.
- -T Tang, C.-L. Fan, Y.-C. Kao, N. Modolo, C.-J. Su, T.-L. Wu, K.-H. Kao, P.-J. Wu, S.-W. Hsaio, A. Useinov, P. Su, W.-F. Wu, G.-W. Huang, J.-M. Shieh, W.-K. Yeh, and Y.-H. Wang, “A Comprehensive Kinetical Modeling of Polymorphic Phase Distribution of Ferroelectric-Dielectrics and Interfacial Energy Effects on Negative Capacitance FETs”, 2019 Symposium on VLSI Technology, Kyoto, Japan, June 2019.
- Yi-Jan Lin, Chih-Yu Teng, Yu-Hua Tsai, Shu-Jui Chang, Chun-Jung Su and Yuan-Chieh Tseng, “Ferroelectric Stability of HfO2 Oxide Semiconductors Probed by X-ray Techniques”, Collaborative Conference on Materials Research (CCMR), Goyang Gyeonggi, South Korea. June 3-7, 2019.
- Chih-Yu Teng, Yi-Jan Lin, Shu-Jui Chang, Chun-Jung Su and Yuan-Chieh Tseng, “Time-dependent Voltage Effects on Microwave Annealed Hf5Zr0.5O2 Ferroelectric Capacitors Probed by X-ray Techniques”, Collaborative Conference on Materials Research (CCMR), Goyang Gyeonggi, South Korea. June 3-7, 2019.
- Jaw-Yeu Liang, Yu-Jun Chou, Wen-Chin Lin, Hong-Ji Lin, Po-Wen Chen, and Yuan-Chieh Tseng,“Hydrogen Sensors Using [Co/Pd]n Structure with Perpendicular Magnetic Anisotropy”, International Conference on Innovative Engineering Technologies (ICIET), Tokyo, Japan, July 7-8, 2019.
- I-Chen Wu, Po-Tsang Huang, Chin-Yang Lo, and Wei Hwang, “An Energy-Efficient Accelerator with Relative Indexing Memory for Sparse Compressed Convolutional Neural Network,” IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS), 2019.
- C. Chen (Award Lecture), “Seebeck effect, Peltier Cooling, and ZT in Atomic/Molecular Junctions from First Principles,” 27th Assembly of Advanced Materials Congress, Sweden, August 11 -14 (2019).
- Huan-Jan Tseng, Po-Tsang Huang, Shang-Lin Wu, Sheng-Chi Lung, Wei-Chang Wang, Wei Hwang and Ching-Te Chuang, “28nm 0.3V 1W2R Sub-Threshold FIFO Memory for Multi-Sensor IoT Applications,” IEEE System-on-Chip Conference (SoCC), pp.1-6, Sept. 2019.
- W. Kang, C. J. Su*, T. H. Hou, “New Contact-first Two-dimensional Transistor,” Int’l Conf. Solid State Devices and Materials (SSDM), 905, Nagoya, Japan, September 2-5 (2019)
- H. Yang, C. J. Su*, Y. S. Wang, K. H. Kao, Y. J. Lee, T. L. Wu*, “Polarization Dependency of Time-Dependent Dielectric Breakdown (TDDB) Characteristics in Ferroelectric HfZrOx,” Int’l Conf. Solid State Devices and Materials (SSDM), 369, Nagoya, Japan, September 2-5 (2019)
- C. Lin, C. Wang, C. N. Kuo, M. W. Lee, J. N. Yao, T. J. Huang, H. T. Hsu, and Edward Y. Chang, “Study of Enhancement-Mode Tri-Gate InAs HEMTs for Low Noise Application”, European Microwave Conference – 1st – 3rd October 2019
- C. Lin, M. W. Lee, M. Y. Tsai, C. Wang, J. N. Yao, T. J. Huang, H. T. Hsu, J. S. Maa, and Edward Y. Chang, “Study of thick copper metallization with WNx as diffusion barrier for AlGaN/GaN HEMTs”, European Microwave Conference – 1st – 3rd October 2019
- Pin-Jun Chen, Chih-Ming Shen, Chih-Chao Yang, Ming-Chi Tai, Wei-Chung Lo, Chang-Hong Shen, Chenming Hu, and Kuan-Neng Chen, “Transient Thermal Damage Simulation for Novel Location-Controlled Grain Technique in Monolithic 3D IC”, IMPACT-IAAC 2019, Taipei, Taiwan, Oct. 23-25, 2019.
- [Invited] Kuan-Neng Chen, Tzu-Chieh Chou, Yi-Chieh Tsai, and Demin Liu, “Low Temperature Cu-Cu Direct Bonding for 3D Integration and Advanced Packaging,” ADMETA Plus 2019, Tokyo, Japan, Oct. 10 – Oct. 11, 2019.
- Yi-Chieh Tsai, Chia-Hsuan Lee, and Kuan-Neng Chen, “Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology”, IEEE 3D System Integration Conference, Sendai, Japan, Oct 8 – Oct 10, 2019.
- Po-Chih Chen, Demin Liu, and Kuan-Neng Chen, “Low-Temperature Wafer-Level Au-Au Bonding at 100°C”, IEEE 3D System Integration Conference, Sendai, Japan, Oct 8 – Oct 10, 2019.
- Demin Liu, Po-Chih Chen, Yi-Chieh Tsai, and Kuan-Neng Chen, “Low Temperature Cu-Cu Direct Bonding Below 150°C with Au Passivation Layer”, IEEE 3D System Integration Conference, Sendai, Japan, Oct 8 – Oct 10, 2019.
- Edward Yi Chang, Quang-Ho Luc, Nhan-Ai Tran, Yueh-Chin Lin, “Negative Capacitance III-V FinFETs for Ultra-Low-Power Applications”, 236th ECS Meeting, Atlanta, GA, Oct. 13-17, 2019.
- [Invited] Kuan-Neng Chen, Tzu-Chieh Chou, Yi-Chieh Tsai, and Demin Liu, “Applications and Schemes based on 3D Heterogeneous Integration,” The 13th International Conference on ASIC (ASICON 2019), Chonqing, China, Oct. 29-Nov.1, 2019.
- [Invited] Kuan-Neng Chen, “Cu-Based Bonded Interconnects for 3D Integration and Advanced Packaging Applications,” 2019 MRS-T Annual Meeting, Tainan, Taiwan, Nov. 15-16, 2019.
- Chanho Lee, Gian Song, Yi Chou, George Kim, Tingkun Liu, Ke An, Wei Chen, Yi-Chia Chou, Yanfei Gao, Peter Liaw “Investigation on Elastic and Plastic Deformation Behaviors of Refractory High-entropy Alloy at Elevated Temperatures via In-situ Neutron Studies” 1st World Congress on High Entropy Alloys (HEA 2019), Nov. 17-20, Seattle, WA, USA
- L. Lin, N. Kawakami, R. Arafune, E. Minamitani, N. Takagi “STS Studies of Layered Topological Materials” 27th International Colloquium on Scanning Probe Microscopy, Shizuoka, Japan, Dec.5-7 (2019).
- H. Chen, H. I. Huang, N. Kawakami, R. Arafune, N. Takagi and C. L. Lin “Non-centrosymmetric Electronic Structures of Defects on Type-II Weyl Semimetals” 27th International Colloquium on Scanning Probe Microscopy, Shizuoka, Japan, Dec.5-7 (2019)
- Tzu-Chieh Chou, Kai-Ming Yang, Jian-Chen Li, Ting-Yang Yu, Ying-Ting Chung, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng, and Kuan-Neng Chen, “Non-Planarization Cu-Cu Direct Bonding and Gang Bonding with Low Temperature and Short Duration in Ambient Atmosphere,” 2019 International Electron Devices Meeting (IEDM), San Francisco CA, Dec. 7-11, 2019.
- Ping-Yi Hsieh, Yi-Jui Chang, Pin-Jun Chen, Chun-Liang Chen, Chih-Chao Yang, Po-Tsang Huang, Yi-Jing Chen, Chih-Ming Shen, Yu-Wei Liu, Chien-Chi Huang, Ming-Chi Tai, Wei-Chung Lo, Chang-Hong Shen, Jia-Min Shieh, Da-Chiang Chang, Kuan-Neng Chen, Wen-Kuan Yeh, and Chenming Hu, “Monolithic 3D BEOL FinFET switch arrays using location-controlled-grain technique in voltage regulator with better FOM than 2D regulators”, 2019 International Electron Devices Meeting (IEDM), San Francisco CA, Dec. 7-11, 2019.
- Su (Invited) and W.-X. You, “Electrostatic Integrity in Negative Capacitance FETs – A Subthreshold Modeling Approach,” 2019 International Electron Devices Meeting (IEDM), 7.3.1-7.3.4, San Francisco, USA, Dec.7-11, 2019.
- S-W. Chang, P.-J. Sung, T-Y. Chu, D. D. Lu, C. -J. Wang, N.-C. Lin, C.-J. Su, S.-H. Lo, H.-F. Huang, J.-H. Li, M.-K. Huang, Y.-C. Huang, S.-T. Huang, H.-C. Wang, Y.-J. Huang, J.-Y. Wang, L.-W Yu, Y.-F. Huang, F.-K. Hsueh, C.-T. Wu, W. C.-Y. Ma, K.-H. Kao, Y.-J. Lee, C.-L. Lin, R.W. Chuang, K.-P. Huang, S. Samukawa, Y. Li, W.-H. Lee, T.-S. Chao, G.-W. Huang, W.-F. Wu, J.-Y. Li, J.-M. Shieh, W. -K. Yeh, Y.-H. Wang, “First Demonstration of CMOS Inverter and 6T-SRAM Based on GAA CFETs Structure for 3D-IC Application” 2019 International Electron Devices Meeting (IEDM), 7.3.1-7.3.4, San Francisco, USA, Dec.7-11, 2019.
- Shu-Jui Chang, Yi-Jan Lin, Chih-Yu Teng, Ying-Tsang Tang ‘‘The Ferroelectric Phase Homogeneity of HfZrO2 Probed by X-ray Absorption’’ in 2020 8th International Conference on Nano and Materials Science (ICNMS2020).
- Chen-Han Chou, Kai-Yu Peng, Kuan-Cheng Lu, Hao-Wei Tu and Shu-Jui Chang ‘‘Demonstration of High-quality WS2 Growth on SiN Substrate by a Low-temperature CVD Process’’ in 2020 8th International Conference on Nano and Materials Science (ICNMS2020).
- Chia-Hsing Wu, Ci-Hao Huang, Chu-Shou Yang, Shin-Yuan Wang and Chao-Hsin Chien ‘‘Study of epitaxial InSe grown on SiO2/Si substrate by molecular beam epitaxy’’ in 2020 8th International Conference on Nano and Materials Science (ICNMS2020).