2021中心學術成果發表

A.專書

  1. Book: Electronic Packaging Science and Technology. King-Ning Tu, Chih Chen, Hung-Ming Chen, Wiley, December, 2021

 

B.期刊論文

  1. Shu-Jui Chang, Chih-Yu Teng, Yi-Jan Lin, Tsung-Mu Wu, Min-Hung Lee, Bi-Hsuan Lin, Mau-Tsu Tang, Tai-Sing Wu, Chenming Hu, Ethan. Ying-Tsan Tang,* Yuan-Chieh Tseng*, “Visualizing Ferroelectric Uniformity of Hf1−xZrxO2 Films Using X‑ray Mapping”, ACS Appl. Mater. Interfaces, 13, 29212−29221 June 2021.(Impact Factor: 8.75) Q1
  2. Yi-Jan Lin, Chih-Yu Teng, Chenming Hu, Chun-Jung Su, Yuan-Chieh Tseng, “Impacts of Surface Nitridation on Crystalline Ferroelectric Phase of Hf1-xZrxO2 and Ferroelectric FET Performance”, Appl. Phys. Lett., 119, 192102 Nov. 2021. (Impact Factor: 3.791) Q1
  3. N. Modolo, S.-W. Tang, H.-J. Jiang, C. Santi, M. Meneghini, and T.-L. Wu, “A novel physics-based analytical approach to analyze and model enhancement-mode p-GaN power HEMTs,” IEEE Transactions on Electron Devices, vol. 68, no. 4, pp. 1489-1494, April. 2021. (Impact Factor: 2.97) Q2 (國際合作)
  4. S.-W. Tang, Z.-H. Huang, Y.-C. Chen, C.-H. Wu, P.-H. Lin, Z.-C. Chen, M.-H. Lu, K.-H. Kao, and T.-L. Wu, “Investigation of the Passivation-induced VTH Shift in p-GaN HEMTs with Au-free Gate-first Process ,” Microelectronics Reliability, pp. 114150, vol. 122, July, 2021. (Impact Factor: 1.59) Q2
  5. S.-W. Tang, S.-C. Chen, and T.-L. Wu, “Analysis of the Subthreshold Characteristics in AlGaN/GaN HEMTs with a p-GaN Gate,” Microelectronics Reliability, vol. 126, 114302 , Nov. 2021 (Impact Factor: 1.59) Q2
  6. S.-W. Tang, P.-Y. Yao, D.-S. Chao, T.-L. Wu, and H.-M. Hsu , “Stability of Wireless Power Transfer using Gamma-ray Irradiated GaN Power HEMTs ,” Microelectronics Reliability, 126, 1114425, Nov. 2021. (Impact Factor: 1.59) Q2
  7. Sung-Lin Tsai, Takuya Hoshii, Hitoshi Wakabayashi, Kazuo Tsutsui, Tien-Kan Chung, Edward Y. Chang, Kuniyuki Kakushima, “Room-Temperature Deposition of a Poling-Free Ferroelectric AlScN Film by Reactive Sputtering”, Phys. Lett. 118, 082902 February 2021 (Impact Factor: 3.791) Q1 (國際合作)
  8. Jui-Sheng Wu, Chih-Chieh Lee, Chia-Hsun Wu, Min-Lu Kao, You-Chen Weng, Chih-Yi Yang, Quang Ho Luc, Ching-Ting Lee, Daisuke Ueda, Edward Yi Chang, “E-Mode GaN MIS-HEMT Using Ferroelectric Charge Trap Gate Stack with Low Dynamic On-Resistance and High Vth Stability by Field Plate Engineering”, IEEE Electron Device Letters, 42, No. 9, pp1268-1271, sept. 2021.(Impact Factor:4.187) Q1
  9. Deepak Anandan, Hung Wei Yu, Edward Yi Chang, Sankalp Kumar Singh, Venkatesan Nagarajan, Ching Ting Lee, Chang Fu Dee, Daisuke Ueda, “Selective area epitaxy of high quality Wurtzite-InAs heterostructure on InGaAs nanopillars at indium-rich region using MOCVD”, Materials Science in Semiconductor Processing, 135, 106103, Aug. 2021. (Impact Factor:3.927) Q1(國際合作)
  10. Pragyey Kumar Kaushik, Sankalp Kumar Singh, Ankur Gupta, Ananjan Basu, Edward Yi Chang, “Impact of Surface States and Aluminum Mole Fraction on Surface Potential and 2DEG in AlGaN/GaN HEMTs”, Nanoscale Res Lett 16, 159 October 2021(Impact Factor:4.703) Q1(國際合作).
  11. Ping-Yu Tsai, Yu Chen, Chun-Hsiung Lin, Edward Yi Chang, “Control of Vth of the enhancement high-frequency AlGaN/GaN HEMT fabricated by oxygen-based digital etching”, Applied Physics Express 14, 126501 November 2021. (Impact Factor: 2.895) Q2
  12. Chun Wang, Yu-Chiao Chen, Heng-Tung Hsu, Yi-Fan Tsao, Yueh-Chin Lin, Chang-Fu Dee, Edward-Yi Chang, “Adoption of the Wet Surface Treatment Technique for the Improvement of Device Performance of Enhancement-Mode AlGaN/GaN MOSHEMTs for Millimeter-Wave Applications”, Materials, 14(21), 6558, Nov. 2021. (Impact Factor:3.623) Q1
  13. Jhang-Jie Jian, Hsin-Ying Lee, Edward Yi Chang, Rorsman Niklas, Ching-Ting Lee, Investigation of Multiple-Mesa-Nanochannel Array GaN-Based MOSHEMTs with Al2O3 Gate Dielectric Layer, ECS Journal of Solid State Science and Technology, 10, 055017, May 2021.(Impact Factor: 2.142) Q2(國際合作)
  14. Chen, S. Cai, N.-W. Hsu, S.-H. Huang, Y. Chuang, E. Nielsen, J.-Y. Li, C. W. Liu, T. M. Lu, and D. Laroche*, “Density dependence of the excitation gaps in an undoped Si/SiGe double-quantum-well heterostructure,” Applied Physics Letters, Vol. 119, No. 22, pp. 223103, Nov. 2021. (Impact Factor: 3.791) Q1 (國際合作)
  15. T. Dolgopolov, M. Yu. Melnikov, A. A. Shashkin, S.-H. Huang, C. W. Liu, and S. V. Kravchenko, “Valley effects on the fractions in an ultrahigh mobility SiGe/Si/SiGe two-dimensional electron system,” Phys. Rev. B, Vol. 103, No. 16, pp. 161302, April 2021. (Impact Factor: 4.036) Q1 (國際合作)
  16. Shie, K. C., Gusak, A. M., Tu, K. N., & Chen, C., A kinetic model of copper-to-copper direct bonding under thermal compression. Journal of Materials Research and Technology, 15, 2332-2344 September 2021. (Impact Factor: 5.039) Q1 (國際合作)
  17. Gusak, A. M., Chen, K. J., Tu, K. N., & Chen, C., Modeling of abnormal grain growth in (111) oriented and nanotwinned copper. Scientific Reports, 11(1), 1-11 October 2021. (IF 4.379) Q1 (國際合作)
  18. Liu, H. C., Gusak, A. M., Tu, K. N., & Chen, C., Interfacial void ripening in CuCu joints. Materials Characterization, 181, 111459 September 2021. (IF 4.342) Q1 (國際合作)
  19. Ong, J. J., Tran, D. P., Yang, S. C., Shie, K. C., & Chen, C., Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly< 111>-Oriented Nanotwinned Cu. Metals, 11(11), 1864 November 2021. (IF 2.35) Q2
  20. Chang, S. Y., Chu, Y. C., Tu, K. N., & Chen, C., Effect of anisotropic grain growth on improving the bonding strength of< 111>-oriented nanotwinned copper films. Materials Science and Engineering: A, 804, 140754 January 2021. (IF 5.234) Q1
  21. Tseng, I. H., Hsu, Y. T., Leu, J., Tu, K. N., & Chen, C. (2021). Effect of thermal stress on anisotropic grain growth in nano-twinned and un-twinned copper films. Acta Materialia, 206, 116637. March,2021(IF 7.656，材料冶金期刊第一名 Ranking top 1.3%)) Q1
  22. Cheng, H. Y., Tran, D. P., Tu, K. N., & Chen, C. (2021). Effect of deposition temperature on mechanical properties of nanotwinned Cu fabricated by rotary electroplating. Materials Science and Engineering: A, 811, 141065. April,2021 (IF 5.234) Q1
  23. Tseng, I. H., Hsu, P. N., Lu, T. L., Tu, K. N., & Chen, C. (2021). Electromigration failure mechanisms of< 1 1 1>-oriented nanotwinned Cu redistribution lines with polyimide capping. Results in Physics, 24, 104154. May,2021(IF 4.476) Q1
  24. Juang, J. Y., Shei, K. C., Li, Y. J., Tu, K. N., & Chen, C. (2021). Low Resistance and High Electromigration Lifetime of Cu-To-Cu Joints Using (111)-Oriented Nanotwinned Copper. Adv. Mater. Lett, 12(8), 21081654. March, 2021 (Impact Factor尚未公布)
  25. Juang, J. Y., Lu, C. L., Li, Y. J., Hsu, P. N., Tsou, N. T., Tu, K. N., & Chen, C. (2021). A solid state process to obtain high mechanical strength in Cu-to-Cu joints by surface creep on (111)-oriented nanotwins Cu. Journal of Materials Research and Technology, 14, 719-730. July, 2021 (Impact Factor: 5.039) Q1
  26. Mo, C. C., Tran, D. P., Juang, J. Y., & Chen, C. (2021). Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2. 3Ag Microbumps with Different UBM Structures under Thermal Cycling. Metals, 11(7), 1065. July, 2021 (Impact Factor: 2.351) Q2
  27. Tran, D. P., Chen, K. J., Tu, K. N., Chen, C., Chen, Y. T., & Chung, S. Electrodeposition of slanted nanotwinned Cu foils with high strength and ductility. Electrochimica Acta, 389, 138640. September 2021 (Impact Factor: 6.901) Q1
  28. Shie, K. C., Hsu, P. N., Li, Y. J., Tran, D. P., & Chen, C. (2021). Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling. Materials, 14(19), 5522. September 2021 (Impact Factor: 3.623) Q1
  29. Hung, Y. W., Tran, D. P., & Chen, C. (2021). Effect of Cu ion concentration on microstructures and mechanical properties of nanotwinned Cu foils fabricated by rotary electroplating. Nanomaterials, 11(8), 2135. August 2021 (Impact Factor: 5.076) Q1
  30. Shie, K. C., Hsu, P. N., Li, Y. J., Tu, K. N., & Chen, C. (2021). Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps. Materials, 14(21), 6394. October 2021 (Impact Factor: 3.623) Q1
  31. Tseng, I. H., Hsu, P. N., Hsu, W. Y., Tran, D. P., Lin, B. T. H., Chang, C. C., … & Chen, C. (2021). Effect of Oxidation on Electromigration in 2-µm Cu Redistribution Lines Capped with Polyimide. Results in Physics, 105048. December 2021 (Impact Factor: 4.476) Q1
  32. Tran, D. P., Li, H. H., Tseng, I. H., & Chen, C. (2021). Enhancement of Electromigration Lifetime of Copper Lines by Eliminating Nanoscale Grains in Highly< 111>-oriented Nanotwinned Structures. Journal of Materials Research and Technology. 15, 6690-6699, November 2021 (Impact Factor: 5.039) Q1
  33. Yi-Jen Huang, Yi-Fan Chen, Po-Han Hsiao, Tu-Ngoc Lam, Wen-Ching Ko, Mao-Yuan Luo, Wei-Tsung Chuang, Chun-Jen Su, Jen-Hao Chang, Cho Fan Chung, E-Wen Huang, “In-Situ Synchrotron SAXS and WAXS Investigation on the Deformation of Single and Coaxial Electrospun P (VDF-TrFE)-Based Nanofibers”, International Journal of Molecular Sciences, 22(23), 12669 Nov. (2021) (Impact factor 5.924) Q1 (國際合作)
  34. Chae, H., Luo, M. Y., Huang, E. W., Shin, E., Do, C., Hong, S.-K., . . . Lee, S. Y. Unearthing principal strengthening factors tuning the additive manufactured 15-5 PH stainless steel. Materials Characterization, 184, 111645. Dec. (2022). Dec. 2021 accepted (Impact factor 4.342; Q1) (國際合作)
  35. Lam, T. N., Ma, C. Y., Hsiao, P. H., Ko, W. C., Huang, Y. J., Lee, S. Y., … & Huang, E. W. “Tunable Mechanical and Electrical Properties of Coaxial Electrospun Composite Nanofibers of P (VDF-TrFE) and P (VDF-TrFE-CTFE)”, International Journal of Molecular Sciences, 22(9), 4639 Apr. (2021). (Impact factor 4.653)Q1 (國際合作)
  36. Huang, C. C., Lam, T. N., Amalia, L., Chen, K. H., Yang, K. Y., Muslih, M. R., … & Huang, E. W. “Tailoring grain sizes of the biodegradable iron-based alloys by pre-additive manufacturing microalloying”, Scientific reports, 11(1), 1-12 May (2021) (Impact factor: 4.379 ) Q1 (國際合作)
  37. Hao-Wei Tu, Che-Chi Shih, Chin-Lung Lin, Meng-Zhe Yu, Jian-Jhong Lai, Ji-Chang Luo, Geng-Li Lin, Wen-Bin Jian,* Kenji Watanabe, Takashi Taniguchi, Chenming Hu, “High Field-Effect Performance and Intrinsic Scattering in The Two-Dimensional MoS2 Semiconductors”, Applied Surface Science, 564, 150422 June 2021. (Impact Factor: 6.182) Q1 (國際合作)
  38. Chi-Ming Chang, Ya-Chen Chiang, Ming-Hsiang Cheng, Shiuan-Huei Lin, Wen-Bin Jian,* Jiun-Tai Chen, Yen-Ju Cheng, Yuan-Ron Ma, and Katzuhito Tsukagoshi,* “Fabrication of WO3 Electrochromic Devices Using Electro-Exploding Wire Techniques and Spray Coating”, Sol. Energy Mater. Sol. Cells 223, 110960 (2021). (Impact Factor: 7.267) Q1 (國際合作)
  39. W.-X. You, B.-K. Huang, and P. Su*, “An Alternative Way for Reconfigurable Logic-in-Memory with Ferroelectric FET,” IEEE Transactions on Electron Devices, 69(1), 444 – 446, Jan. 2022. DOI: 10.1109/TED.2021.3130565. (Impact Factor: 2.917) Q2
  40. S.-E. Huang, W.-X. You, and P. Su*, “Mitigating DIBL and Short-Channel Effects for III-V FinFETs with Negative-Capacitance Effects,” IEEE Journal of the Electron Devices Society (accepted). DOI: 10.1109/JEDS.2021.3133453. Dec. 2021(Impact Factor:2.484) Q2
  41. S.-E. Huang, P. Su* and C. Hu, “S-curve Engineering for ON-state Performance using Anti-ferroelectric/Ferroelectric Stack Negative-Capacitance FinFET,” IEEE Transactions on Electron Devices, 68, pp. 4787-4792, September 2021. (Impact Factor: 2.917)Q2
  42. Y.-S. Liu and P. Su*, “Impact of Trapped-Charge Variations on Scaled Ferroelectric FET Nonvolatile Memories,” IEEE Transactions on Electron Devices, 68, pp. 1639-1643., April 2021. (Impact Factor: 2.917)Q2
  43. Demin Liu, Tsung-Yi Kuo, Yu-Wei Liu, Zhong-Jie Hong, Ying-Ting Chung, Tzu-Chieh Chou, Han-Wen Hu, and Kuan-Neng Chen, “Investigation of Low Temperature Cu-Cu Direct Bonding with Pt Passivation layer in 3D Integration”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 11(4), pp. 573-578, Apr. 2021.(Impact Factor: 1.738) Q2
  44. Tzu-Chieh Chou, Shin-Yi Huang, Pin-Jun Chen, Han-Wen Hu, Demin Liu, Chih-Wei Chang, Tzu-Hsuan Ni, Chao-Jung Chen, Yu-Min Lin, Tao-Chih Chang, and Kuan-Neng Chen, “Electrical and Reliability Investigation of Cu-to-Cu Bonding with Silver Passivation Layer in 3D Integration”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 11(1), pp. 36-42, Jan. 2021. (Impact Factor: 1.738) Q2
  45. Leh-Ping Chang, Jian-Jie Wang, Tzu-Heng Hung, Kuan-Neng Chen, and Fan-Yi Ouyang, “Direct metal bonding using nanotwinned Ag films with (1 1 1) surface orientation under air atmosphere for heterogeneous integration”, Applied Surface Science, 576 (B), 151845, Feb 2022. (Impact Factor: 6.707) Q1
  46. Yi-Chieh Tsai, Yi-Cheng Huang, Yu-Ting Huang, Han-Wen Hu, and Kuan-Neng Chen, “Investigation of Metal Interconnect for Wafer-level and Sealable Miniaturized MEMS Encapsulation”, IEEE Transactions on Electron Devices, 68(11), pp. 5779-5783, Nov. 2021. (Impact Factor: 2.97) Q2
  47. Demin Liu, Po-Chih Chen, Tzu-Chieh Chou, Han-Wen Hu, and Kuan-Neng Chen, “Demonstration of Low-Temperature Fine-Pitch Cu/SiO2 Hybrid Bonding by Au Passivation”, IEEE Journal of Electron Devices Society, 9, pp. 868-875, Oct. 2021. (Impact Factor: 2.555) Q2
  48. Demin Liu, Po-Chih Chen, Yu-Wei Liu, Han-Wen Hu, and Kuan-Neng Chen, “Low-Temperature (70°C) Cu-to-Cu Direct Bonding by Capping Metal Layers”, IEEE Electron Devices Letters, 42(10), pp. 1524-1527, Oct. 2021.(Impact Factor: 2.97) Q1
  49. Yu-Wei Liu, Han-Wen Hu, Ping-Yi Hsieh, Hao-Tung Chung, Shu-Jui Chang, Jui-Han Liu, Po-Tsang Huang, Chih-Chao Yang, Chang-Hong Shen, Jia-Min Shieh, Kuan-Neng Chen, and Chenming Hu, “Single-Crystal Islands (SCI) for Monolithic 3-D and Back-End-of-Line FinFET Circuits,” IEEE Transactions on Electron Devices, vol. 6809, p. 5257, Oct. 2021. (Impact Factor: 2.917) Q2
  50. Jun-Dao Luo, Yu-Ying Lai, Kuo-Yu Hsiang, Chia-Feng Wu, Hao-Tung Chung, Wei-Shuo Li, Chun-Yu Liao, Pin-Guang Chen, Kuan-Neng Chen, Min-Hung Lee, and Huang-Chung Cheng, “Atomic Layer Deposition Plasma-Based Undoped-HfO2 Ferroelectric FETs for Non-Volatile Memory”, IEEE Electron Devices Letters, 42(8), pp. 1152-1155, Aug. 2021. (Impact Factor: 2.97) Q1
  51. Yi-Chieh Tsai, Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Han-Wen Hu, Hiroyuki Ito, Young Suk Kim, Takayuki Ohba, and Kuan-Neng Chen, “Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through Silicon Via”, IEEE Transactions on Electron Devices, 68(7), pp. 3520-3525, Jul. 2021. (Impact Factor: 2.97) Q2 (國際合作)
  52. Yu-Sheng Tsai, Jyun-Rong Chen, Chang-Hsueh Lee, Chih-Chen Kuo, Ya-Hsuan Lin, Chun-Chieh Wang, Yu-Cheng Chang, YewChung Sermon Wu, Hsiang Chen,* “Morphologies and material properties of ZnO nanotubes, ZnO/ZnS core-shell nanorods, and ZnO/ZnS core-shell nanotubes,” Ceramics International Available online 30 November 2021(Impact Factor: 4.527) Q1
  53. Yu-Sheng Tsai, Deng Yi Wang, Jia Jie Chang, Keng Tien Liang, Ya Hsuan Lin, Chih Chen Kuo, Ssu Han Lu, Yewchung Sermon Wu, Lukas Jyuhn-Hsiarn Lee, Hsiang Chen and Dong-Sing Wuu” Incorporation of Au Nanoparticles on ZnO/ZnS Core Shell Nanostructures for UV Light/Hydrogen Gas Dual Sensing Enhancement,” Membranes 11, 903 Dec. (2021). (Impact Factor: 4.106 )Q1
  54. Yu-Sheng Tsai, Shang Che Tsai, Chih Chen Kuo, Wei Lun Chan, Wei Hsiang Lin,YewChung Sermon Wu, Yung Sen Lin, Ming Hsien Li, Ming-Yu Kuo,*, Hsiang Chen,* “Organic/inorganic hybrid nanostructures of polycrystalline perylene diimide decorated ZnO nanorods highly enhanced dual sensing performance of UV light/CO gas sensors” Results in Physics 24, 104173 (May1, 2021). (Impact Factor: 4.476) Q1
  55. An-Yuan Hou, Yi-Hsin Ting, Kuo-Lun Tai, Chih-Yang Huang, Kuo-Chang Lu, Wen-Wei Wu* “Atomic-scale silicidation of low resistivity Ni-Si system through in-situ TEM investigation’’ Applied Surface Science, 538, 148129, Feb. 2021. (Impact Factor: 6.707) Q1
  56. Hsin-Mei Lu, Chih-Yang Huang, Guan-Ming Huang, Kuo-Chang Lu, Wen-Wei Wu* “In-situ Transmission Electron Microscope Investigation of Atomic-scale Titanium Silicide Monolayer Superlattice’’ Scripta Materialia, 193, 6-11, Mar. 2021. (Impact Factor: 5.611) Q1
  57. Caifang Gao, Mu‐Pai Lee, Mengjiao Li, Ko‐Chun Lee, Feng‐Shou Yang, Che‐Yi Lin, Kenji Watanabe, Takashi Taniguchi, Po‐Wen Chiu, Chen‐Hsin Lien, Wen-Wei Wu, Shu‐Ping Lin*, Wenwu Li*, Yen‐Fu Lin*, Junhao Chu* “Mimic Drug Dosage Modulation for Neuroplasticity based on Charge‐Trap Layered Electronics’’ Advanced Functional Materials, 27, 2005182, Jan. 2021. (Impact Factor: 18.808) Q1 (國際合作)
  58. Shin-Bei Tsai, Jui-Yuan Chen*, Chih-Yang Huang, Szu-Yu Hou, Wen-Wei Wu* “Observing Growth and Crystallization of Au@ZnO Core–Shell Nanoparticles by In Situ Liquid Cell Transmission Electron Microscopy: Implications for Photocatalysis and Gas-Sensing Applications’’ ACS Applied Nano Materials, 4, 1, 612–620, Jan. 2021. (Impact Factor: 5.097) Q1
  59. Yi-Hsin Ting, Min-Ci Wu, Yoshitaka Aoyama, Kuo-Chang Lu, Wen-Wei Wu* “In situ Manipulation of E-beam Irradiation-Induced Nanopore Formation on Molybdenum Oxide Nanowires’’ Applied Surface Science, 544, 148874 Apr. 2021. (Impact Factor: 6.707) Q1 (國際合作)
  60. Min-Ci Wu, Jui-Yuan Chen, Yi-Hsin Ting, Chih-Yang Huang, Wen-Wei Wu* “A novel high-performance and energy-efficient RRAM device with multi-functional conducting nanofilaments’’ Nano Energy, 82, 105717, Apr. 2021. (Impact Factor: 17.881) Q1
  61. Szu-Yu Hou, Chih-Yang Huang, Shin-Bei Tsai, Jui-Yuan Chen, Wen-Wei Wu* “In Situ Atomic-Scale TEM Observation of Ag Nanoparticle-Mediated Coalescence in Liquids’’ Applied Surface Science, 546, 149057, Apr. 2021. (Impact Factor: 6.707) Q1
  62. Chih-Yang Huang, Chun-Wei Huang, Min-Ci Wu, Jagabandhu Patra, Thi Xuyen Nguyen, Mu-Tung Chang, Oliver Clemens, Jyh-Ming Ting*, Ju Li, Jeng-Kuei Chang*, Wen-Wei Wu* “Atomic-scale Investigation of Lithiation/Delithiation Mechanism in High-entropy Spinel Oxide with Superior Electrochemical Performance’’ Chemical Engineering Journal, 420, 129838, Sep. 2021. (Impact Factor: 13.273) Q1 (國際合作)
  63. Tzu-Hsuan Yu, Chih-Yang Huang, Min-Ci Wu, Yen-Jung Chen, Lan Tu, Chih- Long Tsai, Jeng-Kuei Chang, Rüdiger-A. Eichel, Wen-Wei Wu* “Atomic-scale Investigation of Na 3 V 2 (PO 4 ) 3 Formation Process in Chemical Infiltration via In situ Transmission Electron Microscope for Solid-State Sodium Batteries’’ Nano Energy, 87,106144, Sep. 2021. (Impact Factor: 17.881) Q1 (國際合作)
  64. Shu-Chin Tsai, Hong-Yang Lo, Chih-Yang Huang, Min-Ci Wu, Yi-Tang Tseng, Fang-Chun Shen, An-Yuan Ho, Jui-Yuan Chen, Wen-Wei Wu* “Structural Analysis and Performance in a Dual-Mechanism Conductive Filament Memristor’’ Advanced Electronic Materials, 7, 2100605, Aug. 2021. (Impact Factor: 7.295) Q1
  65. Fang-Chun Shen, Chih-Yang Huang, Hung-Yang Lo, Wei-You Hsu, Chien-Hua Wang, Chih Chen, Wen-Wei Wu* “Atomic-Scale Investigation of Electromigration with Different Directions of Electron Flow into High-Density Nanotwinned Copper through In Situ HRTEM’’ Acta Materialia, 219, 117250, Aug. 2021. (Impact Factor: 8.203) Q1
  66. Baokun Song, Honggang Gu*, Mingsheng Fang, Zhengfeng Guo, Yen-Teng Ho*, Xiuguo Chen, Hao Jiang, and Shiyuan Liu*, “2D Niobium-Doped MoS2: Tuning the Exciton Transitions and Potential Applications”, ACS Appl. Electron. Mater. 2021, 3, 6, 2564–2572, May 2021.(Impact Factor:3.314)Q2
  67. Iwan Susanto, Chi-Yu Tsai , Yen-Teng Ho, Ping-Yu Tsai, and Ing-Song Yu* , “Temperature Effect of van der Waals Epitaxial GaN Films on Pulse-Laser-Deposited 2D MoS2 Layer”, Nanomaterials, 11, 1406. May 26. 2021 (https://doi.org/10.3390/nano11061406) (Impact Factor: 4.514) Q1 (國際合作)
  68. Anh Thi Nguyen, Ya-Wen Ho, Wei-Cheng Yu, Hsiao-Wen Zan, Hsin-Fei Meng, Yi-Chia Chou “Stable and Reversible Photoluminescence from GaN Nanowires in Solution Tuning by Ionic Concentration” Nanoscale Res. Lett.16, 45, Mar. 2021. (Impact Factor: 3.581) Q1
  69. Yi Chou, Chanho Lee, Peter K. Liaw, and Yi-Chia Chou, “Measurement of Lattice Distortion in NbTaTiV and NbTaTiVZr Using Electron Microscopy”, Measurement of Lattice Distortion in NbTaTiV and NbTaTiVZr Using Electron Microscopy”, Metall Mater Trans A 52, 2094–2099 Mar. (2021). (Impact Factor: 2.05)Q1 (國際合作)
  70. Chanho Lee, Francesco Maresca, Rui Feng, Yi Chou, Tamás Ungár, Michael Widom, Ke An, Jonathan Poplawsky, Yi-Chia Chou, Peter Liaw, and William Curtin, “Strength Can be Controlled by Edge Dislocations in Refractory High-Entropy Alloys” Nature Communications, 12, 5474, Aug. 2021. (Impact Factor: 14.919) Q1 (國際合作)
  71. Y.-F. Tsao and H. -T. Hsu, “A 52–58 GHz Power Amplifier With 18.6-dBm Saturated Output Power for Space Applications,” in IEEE Transactions on Circuits and Systems II: Express Briefs, 68, pp. 1927-1931, June 2021, doi: 10.1109/TCSII.2020.3043343. (Impact Factor: 3.43) Q2
  72. K.-M. Chen, C.-J. Lin, V. Nagarajan, E. Y. Chang, C.-W. Lin, and G.-W. Huang, “Analysis of high-frequency behavior of AlGaN/GaN HEMTs and MIS-HEMTs under UV illumination,” ECS J. Solid State Sci. Technol., vol. 10, Art. no. 055004, May 2021. (Impact Factor: 2.142) Q2
  73. Yong-Cheng Yang, Yi-He Tsai, Pratyay Amrit, Ting-Yu Chen, Hui-Ting Liu, Shen-Yu Wang, Shu-Jung Tang, Chun-Liang Lin, Chao-Hsin Chien, “Influence of Ti doping on the band gap and thermal stability of ultrathin GeOx films” J. Phys. D: Appl. Phys., 54, 345102 May (2021). (Impact Factor: 3.169) Q2

 

C.國際研討會論文

  1. Deepak Anandan, Edward Yi Chang, Hung Wei Yu, Venkatesan Nagarajan, Sankalp Kumar Singh, “Effect of Total Molar Flow Rate on Crystal Structure of Selective Area Epitaxy-InAs NW”, ICONN-2021, SRM University, Chennai, India, February 01-03, 2021.
  2. Deepak Anandan, Edward Yi Chang, Hung Wei Yu, Venkatesan Nagarajan, Sankalp Kumar Singh, “Selective Area Epitaxy of InGaAs/InAs Heterostructure on Si (111) Substrate by MOCVD”, ICONN-2021, SRM University, Chennai, India, February 01-03, 2021.
  3. Deepak Anandan, Edward Yi Chang, Hung Wei Yu, Hua Lun Ko, Venkatesan Nagarajan, Sankalp Kumar Singh, “Selective Area Epitaxy of Axial Wurtzite -InAs Nanowire on InGaAs NW by MOCVD”, 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr.19-22, 2021.
  4. Hua-Lun Ko, Quang Ho Luc, and Edward Yi Chang, “High peak Gm of In0.53Ga0.47As FinFETs with N2 Surface Passivation”, International Conference on Materials, Surface Science and Technology (ICMSST), Berlin, Germany, May 20-21, 2021.
  5. Wang, Y. C. Chen, H. T. Hsu, C. C. Lee, T. J. Huang, and Edward Y. Chang, “Thin Barrier Enhancement-Mode AlGaN/GaN HEMTs with Oxidation Treatment and ALD Al2O3 Dielectric Layer for Power Amplifier Application,” 2021 ICMN, Berlin Germany, May 20 – 21, 2021
  6. Deepak Anandan, Che Wei Hsu, and Edward Yi Chang, “Growth of III-V Antimonide Heterostructure Nanowires on Silicon Substrate for Esaki Tunnel Diode”, NANOSYM 2021, Malaysia, October 11-13, 2021.
  7. Hua-Lun Ko, Quang Ho Luc, Si-Meng Chen, Ping Huang, Jing-Yuan Wu, Che-Wei Hsu, Nhan-Ai Tran, and Edward Yi Chang, “In0.53Ga0.47As Gate-All-Around Nanosheet MOSFETs with Aggressively Improved in Short Channel Effects”, NANOSYM 2021, Malaysia, October 11-13, 2021.
  8. Yan-Kui Liang, Jing-Wei Lin, Jui-Sheng Wu, Chun-Jung Su, Edward Yi Chang, Chun-Hsiung Lin, “Effect of Annealing Temperature on Ferroelectric Properties of ALD Deposited TiN/Hzo/TiN Capacitor”, 240th ECS Meeting, Digital Meeting, Oct. 10-14, 2021.
  9. Shiao, K-M. Chen, G.-W. Huang, “CMOS on-chip dual L-shaped slot antennas,” IEEE Intl. Symp. Radio-Frequency Integration Technology, Taiwan, Aug. 2021.
  10. K.-M. Chen, C.-J. Lin, P.-H. Lin, B.-Y. Chen, V. Nagarajan, E.-Y. Chang, and G.-W. Huang, and, “Bias-dependent source/drain resistance extraction method for GaN-based HEMTs with pulsed measurement,” 2021 International Electron Devices and Materials Symposium, Tainan City, Taiwan, Nov. 2021.
  11. C.-H. Wu, A. Useinov, T.-L. Wu, and C.-J. Su, “Ferroelectric Characterization in Ultrathin Hf0.5Zr0.5O2 MFIS Capacitors by Piezoresponse Force Microscopy (PFM) in Vacuum, “International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), 2021. 
  12. C.-H. Wu, K.-C. Wang, Y.-Y. Wang, T.-L. Wu, C.-J. Su, Y.-J. Lee, and C. Hu, “Enhancement of Ferroelectricity in 5-nm HZO Metal-Ferroelectric-Insulator-Semiconductor Technologies by Using Strained TiN Electrode ,” International Conference on Solid State Devices and Materials (SSDM), 2021.
  13. O. Gallardo, B. De Jaeger, S. Dash, S.-W. Tang., D. Wellekens, B. Bakeroot, S. Decoutere, and T.-L. Wu, “Stability of Schottky Barrier Diode integrated in p-GaN Enhancement-mode GaN power Technology ,” IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2021.
  14. C. Cheng, C. Y. Teng, Y. J. Lin and Y. C. Tseng, “Phase Transformation of the Hf0.5Zr0.5O2 Induced by Pulse Electric Field During Thermal Annealing”, 2021 International Research Conference ICMN, Berlin (virtual conference), Germany, May 20-21, 2021
  15. Akhil Ramesh, Kuan-Ming Chen, Yu-Chen Hsin, Yi-Jan Lin, Pushpapraj Singh, Yuan-Chieh Tseng, Jeng-Hua Wei (Apr 28 2021). AC-09 – Virtualizing CoFeB/MgO Reconstruction Effects on the STT-pMTJ’s Performance, 2021 INTERMAG Conference, Underline Science Inc. April 26-30, 2021
  16. Ong, J. J., Chen, C “Two-Step Fabrication Process for Die-to-Die and Die-to-Wafer Cu-Cu Bonds.” 2021, June 1-July 4, ECTC
  17. Shie, K. C., Chen, C “Hybrid Bonding of Nanotwinned Copper/Organic Dielectrics with Low Thermal Budget.” 2021, June 1-July 4 ECTC
  18. Shie, K. C. ,Chen, C “Non-Destructive Observation of Void Formation due to Electromigration in Solder Microbump by 3D X-Ray.” 2021, June 1-July 4 ECTC
  19. Shie, K. C., Chen, C “Electromigration and Temperature Cycling Tests of Cu-Cu Joints Fabricated by Instant Copper Direct Bonding.” 2021, June 1-July 4, ECTC
  20. Liu, H. C., Chen, C “Low Temperature Cu Direct Bonding with (111)-oriented nanotwinned copper Films on metal substrates” 2021, TMS, March 15-18, 2021
  21. Tseng, I.H., Chen, C “High Electromigration Resistance of Nanotwinned Cu Redistribution Lines for Fan-out Packaging” 2021, TMS, March 15-18, 2021
  22. Hsu, W. Y. Chen, C “Effect of annealing on mechanical properties of nt-Cu lines in Fan-out wafer level packaging.” 2021, TMS March 15-18, 2021
  23. Shie, K. C., Chen, C “Electromigration of Cu-Cu bonds fabricated by instant bonding using <111>-oriented nanotwinned Cu microbumps.” 2021, TMS, March 15-18, 2021
  24. Chen, F. C., Chen, C “Strength Nanotwinned Copper Foils for Current Collectors in Lithium Ion Battery.” 2021, TMS, March 15-18, 2021
  25. Ong, J. J., Chen, C “Enhancement on the bonding strength of instantly-bonded Cu-Cu joints by post annealing.” 2021, TMS March 15-18, 2021
  26. Liu, H. C., Chen, C “Study on interfacial void ripening in nanotwinned Cu-Cu bonding.” 2021, IMPACT, Dec. 21-23
  27. Lin, H. E. Chen, C,“Improvement of bonding strength via anisotropic grain growth in Cu-Cu bonds.” 2021, IMPACT 21-23
  28. Yu, M. H. , Chen, C “Cu-Cu Direct Bonding With Different Grain Size Cu Films.” 2021, IMPACT 21-23
  29. Yang, S. C., Chen, C “Thermal Cycling Test of Highly (111)-oriented Nanotwinned Cu-Cu Joints: Reliability Enhancement” 2021, IMPACT 21-23
  30. Tseng, H. H., Chen C,“Electromigration reliability study of copper-copper joints by instant bonding “ 2021, IMPACT 21-23
  31. Ong, J. J., Chen, C “Reliability Enhancement of Cu-Cu joints by Two-step Bonding Process” 2021, IMPACT 21-23
  32. He, P. S., Chen, C “Low Thermal Budget Hybrid Bonding with Polyimide and Highly <111>-oriented Nanotwinned Cu” 2021, IMPACT 21-23
  33. Tang, C. Y., Chen, C “Research on bonding strength of two-step direct-bonded nanotwinned Cu films” 2021, IMPACT 21-23
  34. So, K. M., Chen, C “Tuning Microstructures in Nanotwinned Cu Films for Low Temperature Cu-Cu Bonding” 2021, IMPACT 21-23
  35. Kuan-Cheng Lu, Pen-Yuan Shih, Yu-Han Lin, Ching-Hwa Ho, Chenming Hu, Wen-Bin Jian, ” Approaching thermodynamic limit of subthreshold-swing for MoS2-FET with laser-writable oxidized 2D TaS2 as gate dielectric” IEDMS 2021, Tainan, Taiwan, November 18 – 19, 2021.
  36. Hao-Tung Chung, Bo-Jheng Shih, Chih-Chao Yang, Nei-Chih Lin, Po-Tsang Huang, Yun-Ping Lan, Kuan-Fu Lai, Wan-Ting Hsu, Yu-Ming Pan, Zhong-Jie Hong, Han-Wen Hu, Huang-Chung Cheng, Chang-Hong Shen, Jia-Min Shieh, Fu-Kuo Hsueh, Bo-Yuan Chen, Da-Chiang Chang, Wen-Kuan Yeh, Kuan-Neng Chen, and Chenming Hu, “Ge Single-Crystal-Island (Ge-SCI) Technique and BEOL Ge FinFET Switch Arrays on Top of Si Circuits for Monolithic 3D Voltage Regulators,” IEEE International Electron Devices Meeting (IEDM), 11-15, 2021.
  37. S.-W.Chang, T.-H. Lu, C.-Y. Yang, C.-J. Yeh, M.-K. Huang, C.-F. Meng, P.-J. Chen, T.-H. Chang, Y.-S. Chang, J.-W. Jhu, T.-Z. Hong, C.-C. Ke, X.-R. Yu, W.-H. Lu, M. A. Baig, T.-C. Cho, P.-J. Sung, C.-J. Su, F.-K. Hsueh, B.-Y. Chen, H.-H. Hu, C.-T. Wu, K.-L. Lin, W. C.-Y. Ma, D.-D. Lu, K.-H. Kao, Y.-J. Lee, C.-L. Lin, K.-P. Huang, K.-M. Chen, Y. Li, S. Samukawa, T.-S. Chao, G.-W. Huang, W.-F. Wu, W.-H. Lee, J.-Y. Li, J.-M. Shieh, J.-H. Tarng, Y.-H. Wang, W.-K. Yeh,”First Demonstration of Heterogeneous IGZO/Si CFET Monolithic 3D Integration with Dual Workfunction Gate for Ultra Low-power SRAM and RF Applications,” IEEE International Electron Devices Meeting (IEDM), Dec. 11-15, 2021.
  38. [Invited] Kuan-Neng Chen, “Low Temperature Cu-Cu Bonding and Platform Development,” IMPACT 2021, Taipei, Taiwan, Dec. 21-23, 2021.
  39. Demin Liu, Yi-Chieh Tsai, Han-Wen Hu, Po-Chi Chen, Chia-Yong Lim, and Kuan-Neng Chen, “Low Temperature Cu-Cu Bonding and Platform Development,” IMPACT 2021, Taipei, Taiwan, Dec. 21-23, 2021.
  40. Hao-Tung Chung, Yu-Ming Pan, Bo-Jheng Shih, Han-Wen Hu, Chih-Chao Yang, Chang-Hong Shen, Huang-Chung Cheng, Kuan-Neng Chen, and Chenming Hu, “Green Nanosecond Laser Crystallized Ge FinFETs for Monolithic 3-D ICs”, International Electron Devices and Materials Symposium (IEDMS), Tainan, Taiwan, Nov. 18-19, 2021.
  41. Jui-Han Liu, Demin Liu, Han-Wen Hu, Bruce Peng, Yuang-Chiu Huang, and Kuan-Neng Chen, “Adjustable Curing Parameters for Flexible Polymer Adhesive Bonding in 3DIC Applications”, International Electron Devices and Materials Symposium (IEDMS), Tainan, Taiwan, Nov. 18-19, 2021.
  42. Chia-Hsin Lee, Baron Huang, Jennifer See, Xiao Liu, Yu-Min Lin, Chao-Jung Chen, and Kuan-Neng Chen, “Versatile laser release material development for chip-first and chip-last fan-out wafer level packaging,” 2021 IEEE 71th Electronic Components and Technology Conference (ECTC), Virtual, Jun. 1 – Jul. 4, 2021.
  43. Tzu-Heng Hung, Ting-Cih Kang, Shan-Yu Mao, Tzu-Chieh Chou, Han-Wen Hu, Hsih-Yang Chiu, Chiang-Lin Shih, and Kuan-Neng Chen, “Investigation of Wet Pretreatment to Improve Cu-Cu Bonding for Hybrid Bonding Applications,” 2021 IEEE 71th Electronic Components and Technology Conference (ECTC), Virtual, Jun. 1 – Jul. 4, 2021.
  44. Zhong-Jie Hong, Demin Liu, Han-Wen Hu, Ming-Chang Lin, Tsau-Hua Hsieh, and Kuan-Neng Chen, “Ultra-High Strength Cu-Cu Bonding under Low Thermal Budget for Chiplet Heterogeneous Applications,” 2021 IEEE 71th Electronic Components and Technology Conference (ECTC), Virtual, Jun. 1 – Jul. 4, 2021.
  45. Yuan-Chiu Huang, Demin Liu, Kuma Hsiung, Tzu-Chieh Chou, Han-Wen Hu, Arvind Sundarrajan, Hsin-Chi Chang, Yi-Yu Pan, Ming-Wei Weng, and Kuan-Neng Chen, “Low Temperature Cu-Cu Bonding with Electroless Deposited Metal Passivation for Fine-Pitch 3D Packaging,” 2021 IEEE 71th Electronic Components and Technology Conference (ECTC), Virtual, Jun. 1 – Jul. 4, 2021.
  46. Shu-Yun Ku, Tzu-Chieh Chou, Yi-Chieh Tsai, Han-Wen Hu, Yu-Ren Fang, Yu-Ju Lin, Po-Tsang Huang, Jin-Chern Chiou, and Kuan-Neng Chen, “Advanced 2.5D Heterogeneous Integrated Platform Using Flexible Biocompatible Substrate for Biomedical Sensing System,” 2021 IEEE 71th Electronic Components and Technology Conference (ECTC), Virtual, Jun. 1 – Jul. 4, 2021.
  47. [Invited] Kuan-Neng Chen, “Low Temperature Cu-Cu Bonding: The Evolution of Bonding Technology,” SNDCT 2021, Hsinchu, Taiwan, May 20-21, 2021.
  48. Ming-Wei Weng, Shan-Yu Mao, Demin Liu, Han-Wen Hu, and Kuan-Neng Chen, “Asymmetric Low Temperature Cu-Polymer Hybrid Bonding with Au Passivation Layer,” 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 19-22, 2021.
  49. P.-T. Huang, T.-W. Liu, W. Lu, Y.-H. Lin, and W Hwang, “An Energy-Efficient Ring-Based CIM Accelerator using High-Linearity eNVM for Deep Neural Networks” IEEE Inernational SoC Design Conference, 2021.
  50. S.Thunder, P. Pal, Y.-H. Wang and P.-T. Huang, “Ultra Low Power 3D-Embedded Convolutional Neural Network Cube Based on α-IGZO Nanosheet and Bi-Layer Resistive Memory,” IEEE International Conference on IC Design and Technology, 2021.
  51. P.Pal, S. Thunder, M.-J. Tsai, P.-T. Huang, and Y.-H. Wang, “Benchmarking the Performance of Heterogeneous Stacked RRAM with CFET-SRAM and MRAM for Deep Neural Network Application Amidst Variation and Noise,” IEEE International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), pp. 1-2, 2021.
  52. Chia-Hsing Wu , Yu-Che Huang , Yen-Teng Ho , Shu Jui Chang , Ssu-Kuan Wu , Chu-Shou Yang , Shin-Yuan Wang and Chao-Hsin Chien , “Single Phase of Two-Dimensional InSe Epi-Growth by Molecular Beam Epitaxy ,” (IEDMS 2021) International Electron Devices &Materials Symposium 2021, National Chung Kung University, Tainan City , Taiwan, November 18-19 , 2021.
  53. Y.-C. Chen, K.-Y. Hsiang, Y.-T. Tang, M.-H. Lee and P. Su*, “NLS based Modeling and Characterization of Switching Dynamics for Antiferroeletric/Ferroelectric Hafnium Zirconium Oxides,” 2021 International Electron Devices Meeting (IEDM), San Francisco, USA, December 11-15, 2021.
  54. Y.-S. Liu and P. Su*, “Evaluation of 2D Ferroelectric-FET NVMs considering Memory Window and Reliability related Interlayer Field,” Extended Abstracts of the 2021 International Conference on Solid State Devices and Materials (SSDM), Japan (Virtual), September 2021.
  55. B.-K. Huang, W.-X. You,and P. Su*, “Investigation and Design of LK-Type Ferroelectric FET for Ultralow-Voltage NVM Applications,” Extended Abstracts of the 2021 International Conference on Solid State Devices and Materials (SSDM), Japan (Virtual), September 2021.
  56. Y.-S. Liu and P. Su*, “Superior Immunity to Trapped-Charge induced Variability in 2D FeFET NVMs,” 2021 Silicon Nanoelectronics Workshop (SNW), All Virtual, Japan, June 13 – , 2021.
  57. B.-K. Huang, W.-X. You, and P. Su*, “Comparison of 2-T FeFET Nonvolatile Memory Cells: Gate Select vs. Drain Select,” 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, April 2021.
  58. S.-E. Huang and P. Su*, “Suppressed Source-to-Drain Tunneling and Short-Channel Effects for MFIS-type InGaAs and Si Negative-Capacitance FinFETs,” 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, April 2021.
  59. Hsu-Hsuan Chin, Chi-Hung Lee, Kun-Yuan Zeng, Yao-Jen Chang, An-Chou Yeh, Jien-Wei Yeh, Su-Jien Lin, Chun-Chieh Wang and E-Wen Huang “Tailoring ferrimagnetic transition temperatures, coercivity fields, and saturation magnetization by the modulation of Mn concentration in (CoCrFeNi)1-xMnx high-entropy alloys” Materials Research Society-Taiwan (MRS-T) Ineternation Conference, Taiwan. 13 Nov. 2021
  60. Mao Yuan Luo, Tu-Ngoc Lam, Soo Yeol Lee, Nien-Ti Tsou, Hung-Sheng Chou, Bo-Hong Lai, Yao-Jen Chang, Rui Feng, Takuro Kawasaki, Stefanus Harjo, Peter K. Liaw, An-Chou Yeh, Ming-Jun Li, Ren-Fong Cai, Sheng-Chuan Lo, E-Wen Huang “Enhancement of fatigue resistance by overload-induced deformation twinning in a CoCrFeMnNi high-entropy alloy” Materials Research Society-Taiwan (MRS-T) Ineternation Conference, Taiwan. 13 Nov. 2021
  61. Kuan-Hung Chen, Chih-Chieh Huang, Pei-I Tsai, Lia Amalia and E-Wen Huang “Tailoring Grain Sizes of the High Strength Selective Laser Melting Biodegradable Iron-based Alloys by Pre-additive Manufacturing Microalloying” Materials Research Society-Taiwan (MRS-T) Ineternation Conference, Taiwan. 13 Nov. 2021
  62. Yu-Hao Wu, E-Wen Huang, Mau-Tsu Tang, and Bi-Hsuan Lin “Anomalous emission of non-polar a-plane MgZnO and ZnO epi-films studied by time-resolved X-ray excited optical luminescence using hybrid bunch mode” Materials Research Society-Taiwan (MRS-T) Ineternation Conference, Taiwan. 13 Nov. 2021
  63. Po-Han Hsiao, Chia-Yin Ma, Wen-Ching Ko, Yi-Jen Huang, Soo-Yeol Lee, Jayant Jain, E-Wen Huang, and Tu Ngoc Lam “Study the Mechanical and Electrical Properties of Coaxial Electrospun Composite Nanofibers of P(VDF-TrFE) and P(VDF-TrFE-CTFE)” Materials Research Society-Taiwan (MRS-T) Ineternation Conference, Taiwan. 13 Nov. 2021
  64. Yu-Ray Chiu, Jo-Chi Tseng, Wei-Chin Huang, Wei Chang, Arno Jeromin, Thomas F. Keller, Andrew Chihpin Chuang, Chu-Chueg Wang, Bi-Hsuan Lin, Lia Amalia, Nien-Ti Tsou, Shao-Ju Shih, E-Wen Huang, Tu-Ngoc Lam “In-situ X-ray diffraction measurement to investigate the deformation mechanisms of Ti-6Al-4V additive-manufacturing-driven isotropic and anisotropic structures” Materials Research Society-Taiwan (MRS-T) Ineternation Conference, Taiwan. 13 Nov. 2021
  65. Deepali Jagga, Artur Useinov, “Point contact model application: The enhanced model of HfxZr1-xO2 based ferroelectric tunnel junctions accounting hysteresis” International Electron Devices & Materials Symposium, IEDMS-2021, Nov.18-19, Tainan, Taiwan (2021).
  66. A. Useinov, V. Korepanov, D. M. Sedlovets “First-principles study: Spin-induced switching of the electronic states filling in Fe-based polyphthalocyanines”, The second international workshop on the properties of Functional MAX Materials, Book of Abstracts of 2nd FunMAX, Sept.14-17, page 30.
  67. A. Useinov, “Application of the point-like contact model: resistance simulation of the single magnetic domain wall” International Baltic Conference on Magnetism 2021, Aug.29-Sept.2, Svetlogorsk, Russia, Book of Abstracts IBCM-2021, page 91.
  68. Chanho Lee, Yi Chou, George Kim, Michael Gao, Ke An, Wei Chen, Jonathan Poplawsky, Gian Song, Yi-Chia Chou, Saryu Fensin, Peter Liaw, “Lattice Distortion and Its Effect on Strength in Refractory High-entropy Alloys” HEA 2021, Virtual, USA, December 5-8, 2021.
  69. Chih-Hung Chung, Tsung-Fu Yang, Chiung-Yuan Lin, Hsin-Hui Huang, Tuo-Hung Hou, and Blanka Magyari-Köpe, “Suppressing the filament formation by Al doping in anatase TiO2,” International Electron Devices and Materials Symposium (IEDMS), Tainan, Taiwan, November 18- 19, 2021.
  70. Chun-Liang Lin, “Scanning Tunneling Microscopy Studies of 2D Materials and Devices” 2021 Taiwan-AVS Chapter: Advances in Scanned Probe Microscopy (Online) Jan. 29 2021
  71. Chun-Liang Lin, “STM/STS Studies of Layered Topological Materials” Nanospec 2021 (Online) Mar. 10-11, 2021
  72. Chun-Liang Lin, “Scanning Tunneling Microscopy Studies of Ultrathin Materials” Hsinchu Oxide Online Forum (Online) Jun. 19, 2021
  73. Chun-Liang Lin, “Temperature-Dependent Electronic Structures of TMD Weyl Semimetals” International Conference on Internal Interface (Germany) Oct. 11-14, 2021
  74. Chun-Liang Lin, “Characterization of 2D Materials and Devices by STM” Global Summit on Condense Matter Physics (Online) Oct. 18-22, 2021
  75. Wan-Hsin Chen, Chun-Liang Lin et al,, “Non-centrosymmetric Electronic Structures of Defects in WTe2” JPS 2021(76th) annual meeting (Online) Mar. 12-15, 2021
  76. Naoya Kawakami, Chun-Liang Lin et al,, “Growth mechanism of Si on Ag(111)” APS March Meeting 2021 (Online) Mar. 15-19, 2021
  77. Wan-Hsin Chen, Chun-Liang Lin et al,, “Identifying Non-centrosymmetric Electronic Structures of Defect in Tungsten Ditelluride” APS March Meeting 2021 (Online) Mar. 15-19, 2021
  78. Guan-Hao Chen, Chun-Liang Lin et al,, “Ultralow-defect-density molybdenum diselenide grown on Au(111) by chemical vapor deposition” The 12th Recent Progress in Graphene and Two-dimensional Materials Research Conference (Online) Oct. 10-14, 2021
  79. Zi-Cheng Wu, Chun-Liang Lin et al,, “Quantum Phase in Niobium Diselenide: Charge Density Wave” 2021 Materials Research Society-Taiwan International Conference (Online) Nov. 13-17, 2021
  80. Naoya Kawakami, Chun-Liang Lin et al,, “Mechanism of dewetting during Si growth on Ag(111)” International Electron Devices & Materials Symposium 2021 (Tainan) Nov. 18-19, 2021
  81. Wan-Hsin Chen, Chun-Liang Lin et al,, “Emergence of Self-Recovery on TMDs Surfaces” International Electron Devices & Materials Symposium 2021 (Tainan) Nov. 18-19, 2021
  82. Pratyay Amrit, Chun-Liang Lin et al,, “Improving Thermal Stability of Ultrathin GeOx Films by Ti Doping” International Electron Devices & Materials Symposium 2021 (Tainan) Nov. 18-19, 2021
  83. Jhe-Jhih Lin, Chun-Liang Lin et al,, “Structures of Bi grown on Nb-doped STO” International Electron Devices & Materials Symposium 2021 (Tainan) Nov. 18-19, 2021
  84. Fu-Xiang Chen, Chun-Liang Lin et al,, “Relationship between defects and mobility in MoS2 FET” International Electron Devices & Materials Symposium 2021 (Tainan) Nov. 18-19, 2021
  85. Pratyay Amrit, Chun-Liang Lin et al,, “Improving Thermal Stability of Ultrathin GeOx Films by Ti Doping” International Symposium on Surface Science (Online) Nov.28 – Dec. 1, 2021
  86. Wan-Hsin Chen, Chun-Liang Lin et al,, “Emergence of Self-Recovery on TMDs Surfaces” International Colloquium on Scanning Probe Microscopy (Online) Dec. 9-10, 2021
  87. Naoya Kawakami, Chun-Liang Lin et al,, “Ag(111)におけるSi結晶の特異な成長様式” 表面・界面スペクトロスコピー 2021 (Online) Dec. 10-11, 2021
  88. Wan-Hsin Chen, Chun-Liang Lin et al,, “Observation of Noncentrosymmetric Characteristics of Defects on Tungsten Ditelluride” 表面・界面スペクトロスコピー 2021 (Online) Dec. 10-11, 2021
  89. Pratyay Amrit, Chun-Liang Lin et al,, “Vibrational Studies of FePc molecule grown on Au(111) using STM-IETS at 77K” 表面・界面スペクトロスコピー 2021 (Online) Dec. 10-11, 2021
  90. Jhe-Jhih Lin, Chun-Liang Lin et al,, “Temperature dependent structural evolution of Bi nano-islands grown on SrTiO3” 表面・界面スペクトロスコピー 2021 (Online) Dec. 10-11, 2021
  91. D. H. Lien, “Monolayer Optoelectronics” International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), invited talk, Taiwan, April 19-22, 2021.
  92. D. H. Lien, “Toward Perfect Brightness in Monolayer Semiconductors” 2021 International Workshop on Materials Science, Osaka, Japan, October 30-31, 2021.
  93. D. H. Lien, “Challenges to developing high-performance monolayer devices, and solutions” International Electron Devices & Materials Symposium 2021 (IEDMS), invited talk, Taiwan, November 18-19, 2021.